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Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

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Abstract:

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.

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Periodical:

Applied Mechanics and Materials (Volumes 754-755)

Pages:

546-550

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.754-755.546

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Online since:

April 2015

Authors:

Rita Mohd Said*, Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Mohd Nazree Derman, Mohd Izrul Izwan Ramli, Norhayanti Mohd Nasir

Keywords:

Intermetallic Compound, Reinforcement, Silicon Carbide (SiC), Sn-Cu-Ni Solder Paste, Solderability, Wetting Angle

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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