Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si3N4) Particles

Norhayanti Mohd Nasir; Norainiza Saud; Mohd Arif Anuar Mohd Salleh; Mohd Nazree B. Derman; Mohd Izrul Izwan Ramli; Rita Mohd Said

doi:10.4028/www.scientific.net/AMM.754-755.535

Paper Titles

Influence of Micron-Size Activated Carbon Additions on the Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni (SN100C) Solder Fabricated via Powder Metallurgy Method
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Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si₃N₄) Reinforcement
p.518

Optimization on Conventional Photolithography Process of 0.98 μm Gap Design for Micro Gap Biosensor Application
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Influence of Silicon Nitride (Si₃N₄) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder
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Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si₃N₄) Particles
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Organic Solar Cell: An Overview on Performance and Fabrication Techniques
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Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste
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The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste
p.551

Mechanical Properties and Solderability of Robust Sn-0.7Cu Lead-Free Composite Solder
p.556

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 754-755Microstructure and Mechanical Properties of...

Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si₃N₄) Particles

Abstract:

This research has investigated the microstructural analysis and shear strength of Sn-1.0Ag-0.7Cu (SAC107) alloy used as matrix while silicon nitride (Si₃N₄) as reinforcement particles with different weight fractions (0, 0.25, 0.5, 0.75 and 1.0 wt. %). The composite solders were fabricated using powder metallurgy (PM) method consisting of mixing, compaction and sintering process. With additions of Si₃N₄ particles, the composite solders experienced a corresponding increase in strength due to fine and homogeneous microstructure. This is signified that the presence of Si₃N₄ particles effectively refines the microstructure.

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Periodical:

Applied Mechanics and Materials (Volumes 754-755)

Pages:

535-539

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.754-755.535

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Online since:

April 2015

Authors:

Norhayanti Mohd Nasir*, Norainiza Saud, Mohd Arif Anuar Mohd Salleh, Mohd Nazree B. Derman, Mohd Izrul Izwan Ramli, Rita Mohd Said

Keywords:

Lead-Free Composite Solder, Microstructure, Powder metallurgy, Shear Strength, Silicon Nitride

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