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NPG Asia Materials, 9(7), e399
Journal of mechanical science and technology, 23(6), 1536-1543
Science and technology of advanced materials, 13(1), 013001
Journal of applied polymer science, 48(10), 1795-1800
Journal of applied polymer science, 106(5), 3343-3347

Experimetal procedure Equipment and materials.
Materials and Manufacturing Process. 25 (2010) 851-856
Materials and Manufacturing Processes. 28 (2013) 381-389
Journal of Materials Technology. 191 (2007) 206-209
Journal of Mechanical Science & Technology, 27 (2013) 177-183.

Flexibility and anti-aging properties are improved when PCB is added to some materials[6].
Experimental Part Materials.
Southwest China Journal of Agricultural Sciences Vol. 19(2006), p.267 In Chinese [6] Yoshika K., Ohsaki T., Furukawa M.
Journal of Applied Polymer Science, Vol. 85 (2002), p. 2053 [7] Chung K.
Journal of Applied Polymer Science, Vol. 108 (2007), p. 3952 [8] Hongbing Jia, Zhigang Jin,Qingmin Ji.

Materials Science Forum.(2009).
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing,(2003).Available from: 10.1016/S0921-5093(03)00615-4 [16] Tibor, Kulcsar., Tamas, Kekesi.
Journal of Materials Processing Technology, 127(1), 2002. pp.96-106
Materials Science Forum, (2020).
Journal of Materials Processing Technology, 127(1),2002.

Ngoh, "Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints," Journal of Electronic Materials, vol. 33, pp. 1219-1226, 2004/10/01 2004
Sonje, "Material issues in electronic interconnects and packaging," Journal of Electronic Materials, vol. 30, pp. 372-378, 2001/04/01 2001
Tanaka, "Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects," Journal of Electronic Materials, vol. 32, pp. 1527-1533, 2003/12/01 2003
Che, "High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications," Journal of Electronic Materials, vol. 41, pp. 2631-2658, Sep 2012
Che, "Microstructure, mechanical, and thermal properties of the Sn-1Ag-0.5Cu solder alloy bearing Fe for electronics applications," Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, vol. 551, pp. 160-168, Aug 15 2012

J13LB08) and the Project of Science and Technology Development Plan of Qingdao (No. 13-1-4-150-jch).
Tuissi, et al: Journal of Materials Engineering and Performance Vol. 21 (2012), p. 2713 [2] S.S.
Jiang, et al: Journal of Shanghai Jiaotong University Vol. 8 (2006), p.1377 (In Chinese) [3] L.C.
Brinson: Journal of Intelligent Material Systems and Structures, Vol. 4 (1993), p.229 [4] W.
Sun: Journal of Wuhan University of Technology-Mater.

Acknowledgements This work was financially supported by the National Natural Science Foundation of China (51005197) and Science and Technology Research and Development Program of Qinhuangdao, China (2012021A091).
Huang, et, al: Journal of Wuhan University of Science and Technology, Vol. 33, (2010), p.238-243 [2] Z.
Wang: Journal of Iron and Steel Research, International, Vol. 14, Issue. 3, (2007), p. 42-46 [4] H.H.
Huétink: Journal of Materials Processing Technology Vol. 148 (2004), p. 328-341 [5] J.
Kang, et, al: Journal of Qinghai University, Vol. 22, No. 1, (2004), p. 25-27, 44 [6] S.

Remanufacturing is a more complex type of reverse supply chain and a general term in a series of technical measures and activities including repair and modification of waste products as the guide of product life cycle design and management theory, as the standard of high quality, high efficiency, energy saving, material saving, environmental protection and in order to achieve waste materials performance improvement also known as the" green manufacturing" [1].
Acknowledgements This work was financially supported by the XI’AN Technological University Principal Fund (605-01001306) and Foundation of Shan’ xi Educational Committee (12JK0072) References [1] Binshi Xu: submitted to Journal of Modern Manufacturing (2009) (In Chinese) [2] Lund R: submitted to Journal of Remanufacturing (1984) [3] Chun Liu, Huajun Cao, Fei Liu, Yanbin Du and Changquan Ding: submitted to Journal of Modern Manufacturing Engineering (2007) (In Chinese) [4] Bin Liu, Binshi Xu, Peijing Shi and Bohai Liu: submitted to Journal of China Surface Engineering (2011 (In Chinese) [5] Hui Li, Zhifeng Liu, Xiangming Kou and Zhangxi Hu: submitted to Journal of Hefei University of Technology(Natural Science) (2008) (In Chinese) [6] Binshi Xu: submitted to Journal of Maschinen Market (2009) (In Chinese) [7] Wei Wang: submitted to Journal of Statistics and Decision (In Chinese) [8] Wenbin Wang and Qinli Da: submitted to Journal of Industrial Engineering and Engineering Management
(2010) (In Chinese) [9] Jing Sun and Xinquan Ge: submitted to Journal of Beijing Information Science & Technology University (2009) (In Chinese) [10] Zhenwei Jin: submitted to Journal of Logistics Technology (2011) (In Chinese)

Laser assisted machining (LAM) is a new and innovative manufacturing process that has been investigated as an alternative to conventional machining of hard and/or difficult-to-process materials such as titanium alloys [2-7].
 The treated material is homogeneous
 The thermal model accurately predicts the volume of material with a temperature high than 980°C , which corresponds to the HAZ .
 The thermal model can be used to determine the laser parameters for a given cut geometry that will yield no residual HAZ in the material after cutting
[2] Chryssolouris, G., Anifantis, N. and Karagiannis, S. (1997) Laser assisted machining: an overview, ASME, Journal of Manufacturing Science and Engineering 119, 766-769

International Journal of Composite Materials.
International Journal of Composite Material.
Construction and Building Materials.
Materials Research.
Materials Science & Engineering.