Electrical Resistivity of Fe-Bearing Sn1Ag0.5Cu Lead-Free Solder Alloys

Abstract:

This paper reports on the effect of Fe addition in the range of 0.1 wt.% to 0.5 wt.% on the electrical resistivity of the Sn-1Ag-0.5Cu (SAC105) solder alloy. The electrical resistivity is characterized by the four-point probe technique. Results showed that the Fe-bearing SAC105 solder alloys exhibit lower electrical resistivity compared with the standard SAC105 solder alloy. Moreover, the electrical resistivity further decreases with increasing the amount of Fe addition. As Fe is a low-cost and non-hazardous element, along with the high mechanical reliability, the Fe-bearing SAC105 solder alloys also demonstrate good electrical characteristics, and hence may be an attractive candidate for a low cost, reliable formulation for lead free solders in electronics packaging.

• Periodical: Advanced Materials Research (Volume 895)
• Pages: 575-579
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.895.575
• Online since: February 2014
• Authors: Nur Aishah Aminah Mohd Amin, Dhafer Abdul Ameer Shnawah, Mohd Faizul Mohd Sabri, Suhana Binti Mohd Said
• Keywords: Electrical Resistivity, Fe Addition, Low Ag Content, Sn-Ag-Cu Solder

References

[1] J. L. Pang, L. Xu, X. Q. Shi, W. Zhou, and S. L. Ngoh, Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints, Journal of Electronic Materials, vol. 33, pp.1219-1226, 2004/10/01 (2004).

DOI: 10.1007/s11664-004-0125-7

[2] K. N. Subramanian, A. Lee, S. Choi, and P. Sonje, Material issues in electronic interconnects and packaging, Journal of Electronic Materials, vol. 30, pp.372-378, 2001/04/01 (2001).

DOI: 10.1007/s11664-001-0046-7

[3] S. Terashima, Y. Kariya, T. Hosoi, and M. Tanaka, Effect of silver content on thermal fatigue life of Sn-xAg-0. 5Cu flip-chip interconnects, Journal of Electronic Materials, vol. 32, pp.1527-1533, 2003/12/01 (2003).

DOI: 10.1007/s11664-003-0125-z

[4] I. E. Anderson, J. C. Foley, B. A. Cook, J. Harringa, R. L. Terpstra, and O. Unal, Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability, Journal of Electronic Materials, vol. 30, pp.1050-1059, 2001/09/01 (2001).

DOI: 10.1007/s11664-001-0129-5

[5] D. A. Shnawah, S. B. M. Said, M. F. M. Sabri, I. A. Badruddin, and F. X. Che, High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications, Journal of Electronic Materials, vol. 41, pp.2631-2658, Sep (2012).

DOI: 10.1007/s11664-012-2145-z

[6] D. A. A. Shnawah, S. B. M. Said, M. F. M. Sabri, I. A. Badruddin, and F. X. Che, Microstructure, mechanical, and thermal properties of the Sn-1Ag-0. 5Cu solder alloy bearing Fe for electronics applications, Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, vol. 551, pp.160-168, Aug 15 (2012).

DOI: 10.1016/j.msea.2012.04.115

[7] D. A. A. Shnawah, S. B. M. Said, M. F. M. Sabri, I. A. Badruddin, and F. X. Che, Novel Fe-containing Sn-1Ag-0. 5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products, Microelectronics Reliability, vol. 52, pp.2701-2708, Nov (2012).

DOI: 10.1016/j.microrel.2012.03.028

[8] E. ÇadIrlI, U. Böyük, H. Kaya, N. Maraşli, S. Aksöz, and Y. Ocak, Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders, Journal of Electronic Materials, vol. 40, pp.195-200, 2011/02/01 (2011).

DOI: 10.1007/s11664-010-1425-8