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Online since: August 2014
Authors: Bo Yang, Yue Tong Chen, Can Huan Li, Jia Ning Lei, Jin He Qian, Nan Ding
The driver of energy-saving car usually be very thin and small so as to light the weight of the whole car and reduce energy consumption.So this paper choose size data of the 5th percentile humans which could be got from China national standard GB10000-1988”China adult body size” [4](N.B. the size data are got from the male between 18 and 60 years old; female between 18 and 55 years old.).Besides,with some adjustments, this method(use uncomfortable indexes to measure comfortable feeling) also could be used into the production car.
But the minimum ground clearance’s reduction results a little increase of drag coefficient(Table 4).
Table 4: The Data of Frontal Area and plan The angle between seat surface and backrest Frontal area (m*m) original 165 degree 0.3951249 0.137 one 155 degree 0.4023378 0.146 two 165 degree 0.4318338 0.153 The Improvement of the plans In order to solve the neck bending problem in plan 1, a foaming agent[Figure 8] is placed beneath the neck of driver.
But the minimum ground clearance’s reduction results a little increase of drag coefficient(Table 4).
Table 4: The Data of Frontal Area and plan The angle between seat surface and backrest Frontal area (m*m) original 165 degree 0.3951249 0.137 one 155 degree 0.4023378 0.146 two 165 degree 0.4318338 0.153 The Improvement of the plans In order to solve the neck bending problem in plan 1, a foaming agent[Figure 8] is placed beneath the neck of driver.
Online since: May 2016
Authors: Athanasios G. Mamalis, Edwin Gevorkyan, S.N. Lavrynenko
Identification of the powder X-ray was carried out based on the filing of the International Centre for Diffraction Data (JCPDS-ICDD).
When the agglomerates reach this 0.6 ... 1 mm, as indicated by the data of electron microscopy images (Fig. 1a, 1b).
According to AFM data for all modes of electroconsolidation chipped in compact passes along the grain boundaries (agglomerates) with the presence of characteristic between grain and between subgrain facets with "streamlet" pattern that apparently indicates instability boundaries [3].
Most samples are characterized by heterogeneous structure, and supplements metastable Al2O3 nanopowders cause the shift of the shrinkage of the tetragonal YSZ to high temperatures affect the reduction of the grain size of the tetragonal YSZ to 170-200nm
When the agglomerates reach this 0.6 ... 1 mm, as indicated by the data of electron microscopy images (Fig. 1a, 1b).
According to AFM data for all modes of electroconsolidation chipped in compact passes along the grain boundaries (agglomerates) with the presence of characteristic between grain and between subgrain facets with "streamlet" pattern that apparently indicates instability boundaries [3].
Most samples are characterized by heterogeneous structure, and supplements metastable Al2O3 nanopowders cause the shift of the shrinkage of the tetragonal YSZ to high temperatures affect the reduction of the grain size of the tetragonal YSZ to 170-200nm
Online since: January 2010
Authors: Nopchulee Cheeveewattanagul, Kalyanee Jirasripongpun, Nuananong Jirakanjanakit, Wanida Wattanakaroon
Toxicity of carriers was determined by the MTT reduction assay [10].
The data were reported as the fraction of the viability of the cells treated with the carriers for 24 and 48 hours relative to the viability of control cells unexposed to the carriers.
The data are reported as the fraction of the viability of the cells incubated with (A) tween 80, (B) Mβ-CD and (C) liposome for 24 (solid bars) and 48 hours (open bars) relative to the viability of control cells unexposed to the carriers.
The data was reported as the amount of complexes delivered per 10 6 cells.
The data were reported as the fraction of the viability of the cells treated with the carriers for 24 and 48 hours relative to the viability of control cells unexposed to the carriers.
The data are reported as the fraction of the viability of the cells incubated with (A) tween 80, (B) Mβ-CD and (C) liposome for 24 (solid bars) and 48 hours (open bars) relative to the viability of control cells unexposed to the carriers.
The data was reported as the amount of complexes delivered per 10 6 cells.
Online since: September 2013
Authors: Qiang Li, Wei Wang
The output signal of the transducers was firstly sent to an charge amplifier which was set 40dB, and then sent to a high-speed A/D converter installed on the computer for data collecting at a sampling rate of 3MHz.
The amplitude is reduced from the first channel to the fourth channel, and the reduction between normal bearing and defective bearing at each channel is decreasing with the increase of the distance between the bearing and transducer.
In the test, we calculated these three features by six-cycle data picked up from the collected data.
The amplitude is reduced from the first channel to the fourth channel, and the reduction between normal bearing and defective bearing at each channel is decreasing with the increase of the distance between the bearing and transducer.
In the test, we calculated these three features by six-cycle data picked up from the collected data.
Online since: August 2013
Authors: Tian Chi Zhang, Jing Zhang, Dan Dan Han
System Architecture and Module Partition
Von Neumann architecture is adopted to build hardware systems and Altera's Avalon bus mode is used in this paper, Nios II completed data exchange with the outside world by Avalon bus.
SD card reset timing diagram PIO Interface Unit and EPCS Controller According to the type of I / O configuration options for the PIO port, due to the LCD is a double-side communication device, thus an 8-Bit Bidirectional port is need to use, PIO register configuration through the software program to control the direction of data transfer of the I / O port.
In the process of user operation of the keys on the screen, the mechanical jitter occurs within a certain period of time, when voltage signal generated by this jitter exceeds the threshold of digital logic, logic error is generated, making the system generated error response, and therefore need to write the screen key anti-shake image stabilization program, therefore need to write the screen button Shake Reduction program.
CPU module uses Overclocking Technology, so that the CPU can have better performance, in order to meet the higher data processing speed, timing-driven of SD card is optimized, SD card reading and writing speed has been improved.
SD card reset timing diagram PIO Interface Unit and EPCS Controller According to the type of I / O configuration options for the PIO port, due to the LCD is a double-side communication device, thus an 8-Bit Bidirectional port is need to use, PIO register configuration through the software program to control the direction of data transfer of the I / O port.
In the process of user operation of the keys on the screen, the mechanical jitter occurs within a certain period of time, when voltage signal generated by this jitter exceeds the threshold of digital logic, logic error is generated, making the system generated error response, and therefore need to write the screen key anti-shake image stabilization program, therefore need to write the screen button Shake Reduction program.
CPU module uses Overclocking Technology, so that the CPU can have better performance, in order to meet the higher data processing speed, timing-driven of SD card is optimized, SD card reading and writing speed has been improved.
Online since: August 2014
Authors: Fuh Kuo Chen, Shi Wei Wang, Heng Kuang Tsai
Although the use of lightweight metals such as aluminum alloy and magnesium alloy can achieve the purpose of weight reduction, the material cost seriously affects the market competition accordingly.
The stress and strain relations obtained from the finite element simulation results recur to those acquired from the experimental data very well.
It is seen in Fig. 3 that the consistency between the experimental data and the finite element results are noted in the tension portions.
The experimental data was also employed to determine the material constants used in the Yoshida-Uemori model and the finite element simulations of the cyclic tension-compression tests with the Y-U material constants re-produce the stress-strain curves quite consistent with those obtained from the experimental results.
The stress and strain relations obtained from the finite element simulation results recur to those acquired from the experimental data very well.
It is seen in Fig. 3 that the consistency between the experimental data and the finite element results are noted in the tension portions.
The experimental data was also employed to determine the material constants used in the Yoshida-Uemori model and the finite element simulations of the cyclic tension-compression tests with the Y-U material constants re-produce the stress-strain curves quite consistent with those obtained from the experimental results.
Online since: June 2004
Authors: Mehran Mehregany, Christian A. Zorman, Srihari Rajgopal, J. Dunning, Xiao An Fu
Young's modulus
Lateral resonant devices (Fig. 2) were used to derive film modulus data.
The spread in the Young's modulus data is likely due to variations Journal Title and Volume Number (to be inserted by the publisher) 3 in beam dimensions within a particular device as a result of lateral variations in the lithographic patterning and SiC etching steps.
This curvature inhibits performance by causing any or all of the following: an electrical short since conductive device elements could touch the substrate, a decrease in electrostatic actuation capability due to reduction in overlap area or an increase in mechanical friction.
Devices were observed using SEM to confirm release and to obtain data such as direction and profile of out-of-plane deflection, beam take-off angle and beam length.
The spread in the Young's modulus data is likely due to variations Journal Title and Volume Number (to be inserted by the publisher) 3 in beam dimensions within a particular device as a result of lateral variations in the lithographic patterning and SiC etching steps.
This curvature inhibits performance by causing any or all of the following: an electrical short since conductive device elements could touch the substrate, a decrease in electrostatic actuation capability due to reduction in overlap area or an increase in mechanical friction.
Devices were observed using SEM to confirm release and to obtain data such as direction and profile of out-of-plane deflection, beam take-off angle and beam length.
Online since: October 2013
Authors: Qing Chun Wang, Wei Liang Dai, Xu Guang Li
Introduction
Nowadays with the increase of automotive ownership, crash safety, foul saving and exhaust reduction were becoming the most important areas for vehicle design.
Tests data included load and crosshead displacement were stored in the computer at a recording rate of one data point every 1 s.
Deformation modes of the stiffened single hat sections (Type II) Resistance force and displacement relationships.The axial resistance force and displacement relationships could be achieved from the data recorded.
Tests data included load and crosshead displacement were stored in the computer at a recording rate of one data point every 1 s.
Deformation modes of the stiffened single hat sections (Type II) Resistance force and displacement relationships.The axial resistance force and displacement relationships could be achieved from the data recorded.
Online since: September 2011
Authors: Jian Cao, Xue Dong Guo, Xiang Yang Fang
Test data and analysis
The test data of water content.
The test data of water stability.
With the further reduction of water content, the bond strength between asphalt and aggregate begins to be restored, making the splitting tensile strength increase.
The test data of water stability.
With the further reduction of water content, the bond strength between asphalt and aggregate begins to be restored, making the splitting tensile strength increase.
Online since: October 2002
Authors: Peter Skeldon, George E. Thompson, A.I. de Sá, Carmen M. Rangel, C.J.E. Smith
From
impedance data, the dielectric constant of the film materials increased with increasing niobium
concentration in the film.
The data of Table 2 reveal a decrease in CPE with increase in film thickness, as expected; further, the mean value of the dielectric constant increases with increase in niobium content of the alloy and corresponding anodic film.
The rate of voltage rise decreases with niobium content of the alloy, indicating a reduction of high field strength for ionic transport with increasing amount of niobium cations in the anodic film.
-The impedance data reveal decreasing capacitance with film thickness for a constant alloy composition, and an increasing mean dielectric constant with increasing niobium content in the alloy and its anodic film.
The data of Table 2 reveal a decrease in CPE with increase in film thickness, as expected; further, the mean value of the dielectric constant increases with increase in niobium content of the alloy and corresponding anodic film.
The rate of voltage rise decreases with niobium content of the alloy, indicating a reduction of high field strength for ionic transport with increasing amount of niobium cations in the anodic film.
-The impedance data reveal decreasing capacitance with film thickness for a constant alloy composition, and an increasing mean dielectric constant with increasing niobium content in the alloy and its anodic film.