Sort by:
Publication Type:
Open access:
Publication Date:
Periodicals:
Search results
Online since: November 2012
Authors: Jorge M. Branco, Hélder S. Sousa, Paulo B. Lourenço
For that reason, a reference element was considered in order to minimize the number of tests and to maximize the amount of information collected from the test campaign.
The tension parallel to the grain tests consisted in the application of a load parallel to the timber grain's main direction.
Tension parallel to the grain tests.
Table 3: Results of the tension parallel to the grain tests.
A reference element was considered in order to minimize the number of tests.
The tension parallel to the grain tests consisted in the application of a load parallel to the timber grain's main direction.
Tension parallel to the grain tests.
Table 3: Results of the tension parallel to the grain tests.
A reference element was considered in order to minimize the number of tests.
Online since: November 2012
Authors: Rui Xia Ma, Jing Shun Wang, Xiao Zhen Li, Wen Cheng Liu
The number of grains of ear was important for seed yield.
The product of each plot grain yield and grain starch content was the starch yield.
grouting of grain.
The analysis on the correlation between yield factors and yield indicated: the correlation between ears number and yield did not reach to significant level (r=0.767, r0.05=0.811); the correlation between grains/ear and yield reached to significant level (r=0.978, r0.01=0.917); and the correlation between 1000 grain weight did not reach to significant level (r=0.669, r0.05=0.811).
Table 4 Effect of NPK Fertilizers Cooperating Application on the Grains, Starch Yield and Yield Factors Treatment Yield Starch Yield Ears Number Grains Per Ear 1000 Grain Weight (kg/hm2) (kg/hm2) (ears/hm2) (grains/ear) (g/1000 grains) 1 6240 Cd 4577 Dd 44125 b 479.5 Bc 298 b 2 6901 Bc 5237 Cc 45875 a 497.3 Bc 313 a 3 8017 Ab 5996Bb 45875 a 540.4 Ab 310a 4 8158 Aa 5959Bb 45875 a 550.4 Aab 313 a 5 6919Bc 5127 Cc 44125 b 487.7 Bc 312 a 6 8393 Aa 6481 Aa 45875 a 569.3 Aa 313 a Confirmation on the Optimization fertilization Scheme The price of high starch maize in 2005 was 1.5RMB/kg; N was 3.2 RMB/kg; P2O5 was 3.4 RMB/kg; K2O was 2.8 RMB/kg; and other investment was unchanged.
The product of each plot grain yield and grain starch content was the starch yield.
grouting of grain.
The analysis on the correlation between yield factors and yield indicated: the correlation between ears number and yield did not reach to significant level (r=0.767, r0.05=0.811); the correlation between grains/ear and yield reached to significant level (r=0.978, r0.01=0.917); and the correlation between 1000 grain weight did not reach to significant level (r=0.669, r0.05=0.811).
Table 4 Effect of NPK Fertilizers Cooperating Application on the Grains, Starch Yield and Yield Factors Treatment Yield Starch Yield Ears Number Grains Per Ear 1000 Grain Weight (kg/hm2) (kg/hm2) (ears/hm2) (grains/ear) (g/1000 grains) 1 6240 Cd 4577 Dd 44125 b 479.5 Bc 298 b 2 6901 Bc 5237 Cc 45875 a 497.3 Bc 313 a 3 8017 Ab 5996Bb 45875 a 540.4 Ab 310a 4 8158 Aa 5959Bb 45875 a 550.4 Aab 313 a 5 6919Bc 5127 Cc 44125 b 487.7 Bc 312 a 6 8393 Aa 6481 Aa 45875 a 569.3 Aa 313 a Confirmation on the Optimization fertilization Scheme The price of high starch maize in 2005 was 1.5RMB/kg; N was 3.2 RMB/kg; P2O5 was 3.4 RMB/kg; K2O was 2.8 RMB/kg; and other investment was unchanged.
Online since: January 2010
Authors: Masahiro Okumiya, Yoshiki Tsunekawa, Kanako Taga, Yuta Fukui
Comparing Fig.3(b) with (c) of the sono-
solidification, it is worth noting that the number
(different solid fractions) of non-equilibrium α-Al
grains increase as the eutectic solidification
proceeded.
3.3 Increase in area fraction of αααα-Al grain
during eutectic solidification
In the sono-solidification of hypereutectic
Al-Si alloy, non-equilibrium α-Al grains increase
as the eutectic solidification proceeded, as
described above.
Comparing Fig.5(a) with Fig5(b), non-equilibrium α-Al grains become more granular and keep on increasing the number as the sono-solidification proceeded.
The profile of silicon content in primary α-Al grains is a concave shape, that is, primary α-Al grains crystallized at higher temperature has the lowest silicon content at the grain center based on the consideration of Fig.6 at ambient pressure.
The Fig.7(b) exhibits that the silicon content in non- equilibrium α-Al grains of Al-18mass%Si alloy solidified with ultrasonic irradiation is higher at each grain center.
(4) Non-equilibrium α-Al grains contain higher silicon content than that in primary α-Al grains of hypoeutectic Al-Si alloy solidified without ultrasonic irradiation.
Comparing Fig.5(a) with Fig5(b), non-equilibrium α-Al grains become more granular and keep on increasing the number as the sono-solidification proceeded.
The profile of silicon content in primary α-Al grains is a concave shape, that is, primary α-Al grains crystallized at higher temperature has the lowest silicon content at the grain center based on the consideration of Fig.6 at ambient pressure.
The Fig.7(b) exhibits that the silicon content in non- equilibrium α-Al grains of Al-18mass%Si alloy solidified with ultrasonic irradiation is higher at each grain center.
(4) Non-equilibrium α-Al grains contain higher silicon content than that in primary α-Al grains of hypoeutectic Al-Si alloy solidified without ultrasonic irradiation.
Online since: June 2010
Authors: Tetsuya Ohashi, Tsuyoshi Mayama, Kenji Higashida
That is, one grain consisting of bi-crystal (grain A) had the crystal orientation whose
Schmid factor for prismatic slip is 0.5.
The crystal orientation of the other grain (grain B) was slightly deviated from that of grain A.
Although a number of crystal plasticity models have been proposed and described the anisotropic deformation behaviour of polycrystalline magnesium [1, 2], single crystal parameters used in the calculations significantly differ to the experimental values of CRSSs [3, 4].
The Schmid factor of a Prismatic slip system in grain A is 0.5 and the crystal orientation of grain B is slightly deviated from grain A.
Analyses of tensile loading of single crystal models with Euler angles for grain A and grain B are also performed.
The crystal orientation of the other grain (grain B) was slightly deviated from that of grain A.
Although a number of crystal plasticity models have been proposed and described the anisotropic deformation behaviour of polycrystalline magnesium [1, 2], single crystal parameters used in the calculations significantly differ to the experimental values of CRSSs [3, 4].
The Schmid factor of a Prismatic slip system in grain A is 0.5 and the crystal orientation of grain B is slightly deviated from grain A.
Analyses of tensile loading of single crystal models with Euler angles for grain A and grain B are also performed.
Online since: October 2007
Authors: Sergey V. Dobatkin, Libor Kraus, Jozef Zrník
The number of passes at each
temperature was N = 3.
The term "ultrafine grain structure" is referring to nanostructure with grain size of less than 100 nm, and submicrocrystalline structure with grains between 100 and 1000 nm.
Currently, there are two main approaches for refining ferrite grains down to the ultrafine grain range in bulk steels.
The effect of strain non-uniformity across the plane X upon three-fold die pressing affected structure forming regardless the number of ECAP passes involved.
As pointed out previously, a multi-pass ECAP produces remarkably uniform microstructure if the number of passes is higher then three and if the angle of intersection of channels is φ = 90°.
The term "ultrafine grain structure" is referring to nanostructure with grain size of less than 100 nm, and submicrocrystalline structure with grains between 100 and 1000 nm.
Currently, there are two main approaches for refining ferrite grains down to the ultrafine grain range in bulk steels.
The effect of strain non-uniformity across the plane X upon three-fold die pressing affected structure forming regardless the number of ECAP passes involved.
As pointed out previously, a multi-pass ECAP produces remarkably uniform microstructure if the number of passes is higher then three and if the angle of intersection of channels is φ = 90°.
Online since: August 2011
Authors: Akihiro Sakaguchi, Tomoyuki Kawashita, Shuji Matsuo
However a very large number of measurements are necessary, because the spot diameter is very small.
It is well known that super-abrasive grain represented by a diamond abrasive grain is formed a wear-flat area at the most highest part of grains [6].
Comparison of images by different irradiation lights 2.2 Measurement of cutting edges It is well known that super-abrasive grain represented by a diamond abrasive grain formed a wear flat at the most highest part of grains.
Extracted abrasive grains Fig. 9.
Analysis results Number of grains 4 Proportion of grains 5.44% A Area of grain 5781 [pixel] C Area of grain 4483 [pixel] Internal lack 293 [pixel] Internal lack 43 [pixel] External lack 36 [pixel] External lack 12 [pixel] B Area of grain 1969 [pixel] D Area of grain 5381 [pixel] Internal lack 138 [pixel] Internal lack 267 [pixel] External lack 378 [pixel] External lack 11 [pixel] Fig. 10.
It is well known that super-abrasive grain represented by a diamond abrasive grain is formed a wear-flat area at the most highest part of grains [6].
Comparison of images by different irradiation lights 2.2 Measurement of cutting edges It is well known that super-abrasive grain represented by a diamond abrasive grain formed a wear flat at the most highest part of grains.
Extracted abrasive grains Fig. 9.
Analysis results Number of grains 4 Proportion of grains 5.44% A Area of grain 5781 [pixel] C Area of grain 4483 [pixel] Internal lack 293 [pixel] Internal lack 43 [pixel] External lack 36 [pixel] External lack 12 [pixel] B Area of grain 1969 [pixel] D Area of grain 5381 [pixel] Internal lack 138 [pixel] Internal lack 267 [pixel] External lack 378 [pixel] External lack 11 [pixel] Fig. 10.
Online since: February 2014
Authors: Walter Lindolfo Weingaertner, Lucas Benini, Lucas da Silva Maciel
This study aims to use a diamond tip to plunge further on the grinding wheel, beyond the point of plastic deformation, to obtain a relation between depth of contact and number of collisions between the diamond and abrasive grains.
The full process is performed in two other positions along the width of the grinding wheel and the average number of grains is evaluated for each depth of contact.
Fig. 5 Signal intensity and number of kinematic edges on the grinding wheel using abrasive grains Type A.
Fig. 6 Signal intensity and number of kinematic edges on the grinding wheel using abrasive grains Type B.
Although it is difficult to classify each peak on the AE signal as a perfect collision between the diamond and a whole grain, it is possible to relate the total collision count to the number of kinematic edges and therefore observe the wear influence over the number of active grains.
The full process is performed in two other positions along the width of the grinding wheel and the average number of grains is evaluated for each depth of contact.
Fig. 5 Signal intensity and number of kinematic edges on the grinding wheel using abrasive grains Type A.
Fig. 6 Signal intensity and number of kinematic edges on the grinding wheel using abrasive grains Type B.
Although it is difficult to classify each peak on the AE signal as a perfect collision between the diamond and a whole grain, it is possible to relate the total collision count to the number of kinematic edges and therefore observe the wear influence over the number of active grains.
Online since: February 2013
Authors: Daniel Gurgul, Wojciech Kapturkiewicz, Jacek Początek, Marek Wróbel, Andriy A. Burbelko
Grain nucleation in industrial alloys has a heterogeneous nature.
The number of active substrates in the domain V of the melt with an undercooling ΔT below the liquidus may be calculated on the basis of the cumulative distribution function F(ΔT): , (1) where: Nmax is the maximum specific number of substrates for nucleation.
The next way of substrate placement and the undercooling of nucleation selection is proposed in [12] based on the mean number of active substrates in one cell of CA.
The specific shape and volume of this polyhedron, as well as the number of faces and edges depend on the positions of the nearest neighbouring nuclei.
Grain number [m-3]: 1) n = 1015; 2) n = 5·1014.
The number of active substrates in the domain V of the melt with an undercooling ΔT below the liquidus may be calculated on the basis of the cumulative distribution function F(ΔT): , (1) where: Nmax is the maximum specific number of substrates for nucleation.
The next way of substrate placement and the undercooling of nucleation selection is proposed in [12] based on the mean number of active substrates in one cell of CA.
The specific shape and volume of this polyhedron, as well as the number of faces and edges depend on the positions of the nearest neighbouring nuclei.
Grain number [m-3]: 1) n = 1015; 2) n = 5·1014.
Online since: March 2014
Authors: Rouhollah Mohsen Pezeshkian, Peyman Shayanfar, Saiedeh Shafaiepour
Introduction
P460N alloy steel comes from the fine grain normalized steels family [1].
Therefore, fine grain steels still remain so fine.
Therefore, it is suitable to be used in welding fine grain steels.
Grain size Groove angles(α) Test regions No.
Table 12 .Macro hardness test based on test regions’ number Groove angles(α) Test regions No.
Therefore, fine grain steels still remain so fine.
Therefore, it is suitable to be used in welding fine grain steels.
Grain size Groove angles(α) Test regions No.
Table 12 .Macro hardness test based on test regions’ number Groove angles(α) Test regions No.
Online since: August 2013
Authors: Yun Yun Zhang, Xiao Wei Sun, Jun Liang Zhao, Hai Tao Dai, Shu Guo Wang, Wen Yu Kuo, Liann Be Chang, Bohr Ran Huang
In this paper, we compared four flip-chip LED devices with four different numbers of Au stud bumps.
However, when the number of Au stud bumps was larger than 24, the heat dissipation performance will become deteriorated due to the poor bonding between grain and substrate.
Fig. 5 shows the EL spectra of flip-chip LEDs with different numbers of Au stud bumps.
The current-temperature curves of non flip-chip LED and flip-chip LEDs with different number of Au stud bumps Conclusion This study has investigated the optimization of the Au stud bumps number for flip-chip LED.
However, the excessive number of Au stud bumps can lead to the poor bonding between the grain and the substrate, and thus affect the electrical resistance and heat dissipation characteristics.
However, when the number of Au stud bumps was larger than 24, the heat dissipation performance will become deteriorated due to the poor bonding between grain and substrate.
Fig. 5 shows the EL spectra of flip-chip LEDs with different numbers of Au stud bumps.
The current-temperature curves of non flip-chip LED and flip-chip LEDs with different number of Au stud bumps Conclusion This study has investigated the optimization of the Au stud bumps number for flip-chip LED.
However, the excessive number of Au stud bumps can lead to the poor bonding between the grain and the substrate, and thus affect the electrical resistance and heat dissipation characteristics.