Optimization of the Au Stud Bump Number for the Flip-Chip Packaged InGaN LEDs

Yun Yun Zhang; Xiao Wei Sun; Wen Yu Kuo; Liann Be Chang; Bohr Ran Huang; Jun Liang Zhao; Hai Tao Dai; Shu Guo Wang

doi:10.4028/www.scientific.net/AMR.753-755.2515

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 753-755Optimization of the Au Stud Bump Number for the...

Optimization of the Au Stud Bump Number for the Flip-Chip Packaged InGaN LEDs

Abstract:

Au stud bump can provide a good heat spreading path for the flip-chip LED due to its high thermal conductivity (300 W/mK) . In this paper, we compared four flip-chip LED devices with four different numbers of Au stud bumps. The thermal imaging analysis indicates that the heat dissipation is proportional to the number of Au stud bump. However, when the number of Au stud bumps was larger than 24, the heat dissipation performance will become deteriorated due to the poor bonding between grain and substrate. Therefore, the number of Au stud bumps was optimized to be 20 to 24, which can be employed to develop flip-chip LEDs with optimum electrical and optical performance.

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Periodical:

Advanced Materials Research (Volumes 753-755)

Pages:

2515-2520

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.753-755.2515

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Online since:

August 2013

Authors:

Yun Yun Zhang, Xiao Wei Sun, Wen Yu Kuo, Liann Be Chang, Bohr Ran Huang, Jun Liang Zhao, Hai Tao Dai, Shu Guo Wang

Keywords:

Au Stud Bumps, Flip-Chip LED, Thermal Analysis, Thermosonic Bonding

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