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With the rapid development of concrete technology, increasingly higher technical requirements of modern concrete sand, especially with high strength and high performance concrete to aggregate are strict, fewer and fewer number of natural sand can meet their requirements, not even.Thus, the development of new sources of sand (artificial sand) is imperative [1-2].
Maximum grain size of coarse aggregate is 31.5mm.

It can be seen from the quantity statistics on failure elements at different loading stages (in Figure 3) that the number of failure elements at the CE stage is quite large.
And then the tensile cracks are continuously produced on the grain boundaries, which is consistent with the conclusion mentioned in Reference [12].

The further EDX spectra inspections showed higher C/Cr/Mo peak between grains, as shown in Figure 4.
Inden: The Journal of Corrosion Science and Engineering Vol. 6 (2003), Conference Paper Number H043 [9] B.

Interconnect is a critical component in SOFC as it functions to bridge structurally and electrically a number of sequentially stacked unit cells.
The micrograph shows sharp ant discrete stereo-granular structure, and each grain should be an oxide compound as the SEM/EDS analysis displays significant oxygen content.

Introduction Colloidal processing techniques provide the possibility to manufacture complex-shaped ceramic products with minimal number of detrimental defects, which require the use of stable slurries with high solid loadings [1,2].
The grain size of the sintered body falls in the range of 1.5~3.0μ m.

With such a thin barrier film, even minute structural defects like cracks, voids or grain boundaries, can adversely affect its barrier performance.
Fig. 2 shows the total displacement (TD) of the single atoms calculated from anrnrTD N n∑= −−= 1 |)1()(| (1) where N is the number of time intervals in the computation, r(n) is the position of the metal atom at interval n and a is the dimension of the periodic cell. 0 200 400 600 800 1000 1200 1400 0 0.5 1 1.5 2 Time (ps) Speed (m/s) Cu Ta Fig. 1: Speed of Cu and Ta atoms in linear amorphous polymer (LAP) It is noted that although the mass of Ta atoms is only twice that of Cu, the TD of Cu is 4 times that of Ta.

This model is corresponding to emission of thermal carrier across grain boundary where the conductivity is anticipated to be linear with temperature [12].
The carrier concentration in this temperature range is number of ionized donor liberated from impurity levels.

Generally speaking, the distribution of NiFe grains with various orientations is different for NiFe films deposited on different buffer layer [6].
Therefore the number of domain walls and domains present for an irradiated sample is increased compared to the non-irradiated case which results in an enhancement of the exchange bias field according to Malozemoff's model [8].

ECC can avoid heating up the powder bringing on Grain Growth or Crystallization, so it can manufacture not only groovy metal or nonmetal coating but also nano or amorphous coating.
Table.1 experiment parameter Test number 1 2 3 4 Height of burst (mm) 4 4 10 10 Annealing treatment Yes No Yes No Fig.3 shows the clad plates of copper plate and copper powder manufactured in ECC experiment.

The number of crystallites flowing away from the S' orientation is less than that flowing into the S' orientation from the B' orientation.
The crystallites moving to the C' orientation from the S' orientation counteract the loss of the C'-oriented grains during rolling leading to an increase in the intensity of the C' orientation before 40% rolling reduction.