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Online since: November 2011
Authors: Zhen Liang Li, Wei Chen, Hui Ping Ren, Tong Le Wang, Yu Feng Wang
The microstructure and phase composition was analyzed by Hitachi-S3400 SEM, BRUKERD8-ADVANCE XRD.
Powder Metall Vol. 29(1993), p. 321 [4] Liu M P, Wang Q D, Liu Z L: Journal of Materials Science Letters Vol. 21(2002), p. 1281 [5] Peng J G, Wang Q D, Liu M P, et al: Material Science Forum Vol. 488-489(2005), p. 257 [6] Li Z L, Ren H P, Wang Y F, et al: Advanced Materials Research Vol. 189-193(2011), p. 1194 [7] Zhendong Wang, Wei Chen, Youqi Wang: Ordnance Material Science and Engineering Vol. 32(2009), p. 96 (In Chinese) [8] Zhenhua Chen, Weijun Xia, Hongge Yan, et al: Wrought Magnesium Alloys (Chemical Industry Press, Beijing 2005)(In Chinese) [9] Pekgularyuz M, Renand J: Mine Metals & Mater Soc Vol. 279(2000), p. 578 [10]Shi L L, Xu J, Evan M: Metals & Materials Society and ASM International Vol. 39(2008), p. 1225
Powder Metall Vol. 29(1993), p. 321 [4] Liu M P, Wang Q D, Liu Z L: Journal of Materials Science Letters Vol. 21(2002), p. 1281 [5] Peng J G, Wang Q D, Liu M P, et al: Material Science Forum Vol. 488-489(2005), p. 257 [6] Li Z L, Ren H P, Wang Y F, et al: Advanced Materials Research Vol. 189-193(2011), p. 1194 [7] Zhendong Wang, Wei Chen, Youqi Wang: Ordnance Material Science and Engineering Vol. 32(2009), p. 96 (In Chinese) [8] Zhenhua Chen, Weijun Xia, Hongge Yan, et al: Wrought Magnesium Alloys (Chemical Industry Press, Beijing 2005)(In Chinese) [9] Pekgularyuz M, Renand J: Mine Metals & Mater Soc Vol. 279(2000), p. 578 [10]Shi L L, Xu J, Evan M: Metals & Materials Society and ASM International Vol. 39(2008), p. 1225
Online since: August 2021
Authors: Renat V. Gavariev, Ksenia N. Gavarieva
Borisade, Zinc-aluminum (ZA-27)-based metal matrix composites: a review article of synthesis, reinforcement, microstructural, mechanical, and corrosion characteristics, International Journal of Advanced Manufacturing Technology. 100(1-4) (2019) 373-380
Series: Materials Science and Engineering. 969 (2020) 012021
Series: Materials Science and Engineering. 570 (2019) 012072
Series: Materials Science and Engineering. 570 (2019) 012039
Series: Materials Science and Engineering. 240 (2017) 012019.
Series: Materials Science and Engineering. 969 (2020) 012021
Series: Materials Science and Engineering. 570 (2019) 012072
Series: Materials Science and Engineering. 570 (2019) 012039
Series: Materials Science and Engineering. 240 (2017) 012019.
Online since: November 2012
Authors: Zoltán Gácsi, József Tóth, Judit Pázmán, Viktor Mádai
International Symposium on Advances in Cast Reinforced MMC (1988) 13
Materials Science Forum (vols. 473-474), (2005 ) 415-420
Materials Science and Engineering A 303, (2001) 292-301
Colloids and Surfaces A: Physicochemical and Engineering Aspects 235 (2004) (1-3) , 45-55
Materials Science Forum Vol. 553, (2007) 257-265
Materials Science Forum (vols. 473-474), (2005 ) 415-420
Materials Science and Engineering A 303, (2001) 292-301
Colloids and Surfaces A: Physicochemical and Engineering Aspects 235 (2004) (1-3) , 45-55
Materials Science Forum Vol. 553, (2007) 257-265
Online since: May 2022
Authors: Corneliu Marius Crăciunescu, Gheorghe Amadeus Chilnicean, Vlad Marius Bolocan, Dragoș Dumitru Vâlsan, Andrei Novac, Aurel Ercuța
Earthman, “Corrosion evaluation of wear tested nitinol wire”, Materials Science and Engineering, vol. 25, pp. 276-281, 2005
Saburi, “Martensitic transformation and two-way shape memory effect of sputter-deposited Ni-rich Ti–Ni alloy films”, Materials Science and Engineering, pp. 749-753, 1999
Melton, in ”Engineering Aspects of Shape Memory alloys”, Butterworth and Heinemann, 1990, p. 21. [9] D.
Knick, “Optimization of MEMS Actuator Driven by Shape Memory Alloy Thin Film Phase Change”, in Advanced Functional Materials, IntechOpen, 2020, pp. 25-35. [11] C.
Novac, “Optimization of thermal deflection in NiTi-based bimorph microactuators”, in Advanced Materials and Structures 2020, Timisoara
Saburi, “Martensitic transformation and two-way shape memory effect of sputter-deposited Ni-rich Ti–Ni alloy films”, Materials Science and Engineering, pp. 749-753, 1999
Melton, in ”Engineering Aspects of Shape Memory alloys”, Butterworth and Heinemann, 1990, p. 21. [9] D.
Knick, “Optimization of MEMS Actuator Driven by Shape Memory Alloy Thin Film Phase Change”, in Advanced Functional Materials, IntechOpen, 2020, pp. 25-35. [11] C.
Novac, “Optimization of thermal deflection in NiTi-based bimorph microactuators”, in Advanced Materials and Structures 2020, Timisoara
Online since: October 2010
Authors: Frank Wirbeleit
Non-Gaussian Local Density Diffusion (LDD-) Model
for Boron Diffusion in Si- and SixGe1-x Ultra-Shallow Junction
Post-Implant and Advanced Rapid-Thermal-Anneals
Frank Wirbeleit
GLOBALFOUNDRIES,
D-01109 Dresden,
Germany
Frank.Wirbeleit@globalfoundries.com
Keywords: Boron, Diffusion, Germanium, Implant, Non-Gaussian Diffusion Model, SiGe, Silicon, Ultra-Shallow Junction
Abstract
Boron diffusion after implant and anneal has been studied extensively in the past, without de-convoluting the Boron diffusion behavior by the initial post implant Boron concentration profile, which is done in this work first time.
Introduction Shrinking microelectronic devices feature sizes requires understanding and controlling dopant diffusion lengths by advanced rapid thermal anneals for ultra shallow junctions.
Introducing SiGe hetero structures in microelectronic device junctions agglomerates all Boron diffusion and advanced rapid thermal anneal learning to gain high performance PFET devices [1][2], boosting product performance and challenging performance-stability control [3].
This result of “no significant” boron diffusion length after ultra short anneal correlates to other results, and shows the capability of Laser anneal for “diffusion less” dopant activation in microelectronic device USJ engineering [19][20][21].
Phys., 104 (2008) 4, pp.044908-1 .. 044908-7, doi:10.1063/1.2968462 [21] Feudel, T.:” Advanced Annealing Schemes for High-Performance SOI Logic Technologies”, Materials Science Forum; March, 573-574(2008), pp. 387-400 [22] Jones, K.S.; Kuryliw, E.; Murto, R.; Rendon, M.; Talwar, S.; :"Boron diffusion upon annealing of laser thermal processed silicon ", Ion Implantation Technology”, 2000.
Introduction Shrinking microelectronic devices feature sizes requires understanding and controlling dopant diffusion lengths by advanced rapid thermal anneals for ultra shallow junctions.
Introducing SiGe hetero structures in microelectronic device junctions agglomerates all Boron diffusion and advanced rapid thermal anneal learning to gain high performance PFET devices [1][2], boosting product performance and challenging performance-stability control [3].
This result of “no significant” boron diffusion length after ultra short anneal correlates to other results, and shows the capability of Laser anneal for “diffusion less” dopant activation in microelectronic device USJ engineering [19][20][21].
Phys., 104 (2008) 4, pp.044908-1 .. 044908-7, doi:10.1063/1.2968462 [21] Feudel, T.:” Advanced Annealing Schemes for High-Performance SOI Logic Technologies”, Materials Science Forum; March, 573-574(2008), pp. 387-400 [22] Jones, K.S.; Kuryliw, E.; Murto, R.; Rendon, M.; Talwar, S.; :"Boron diffusion upon annealing of laser thermal processed silicon ", Ion Implantation Technology”, 2000.
Online since: August 2013
Authors: Yi Ge Liu, Hai Rong Tang
There are great subjectivity and tendentiousness during bid evaluation of engineering construction projects, which may cause deviation to bid evaluation results of bidding work.
BP neural network model for bid evaluation of construction projects is built in the thesis, and the model can solve non-linear issues in the bid evaluation construction engineering projects well.
Table 1 Bid Evaluation Index System of Construction Bid Projects Index name Presentation form of index Details of index Quotation x1 Quotation of contractors Time limit of a project x2 The bidding party tries hard to realize commitment for duration target (x21) Whether construction schedule and measures are scientific, reasonable, and reliable, x22 Quality x3 Whether target and measures in the engineering quality management system meet requirements of bid documents Construction scheme x4 Whether construction organization scheme is advanced, reasonable, and complete (x41) Quantity and qualification of the project’s main management and engineering technicians (x42) Equipment, financial resources, and manpower input in the project are reasonable or not (x43) Whether technical measures are safe and reliable or not (x44) Whether quality assurance measures are reasonable, normal, and perfect (x45) Corporate reputation and performances x5 Performance conditions of construction contracts
[3]Qian Jiazhong, Lv Chun, and Zhao Weidong, Joural of System Engineering Theory and Practice, 2010 (1):145-150
Joural of Economic Forum, 2010 (3): 203-204
BP neural network model for bid evaluation of construction projects is built in the thesis, and the model can solve non-linear issues in the bid evaluation construction engineering projects well.
Table 1 Bid Evaluation Index System of Construction Bid Projects Index name Presentation form of index Details of index Quotation x1 Quotation of contractors Time limit of a project x2 The bidding party tries hard to realize commitment for duration target (x21) Whether construction schedule and measures are scientific, reasonable, and reliable, x22 Quality x3 Whether target and measures in the engineering quality management system meet requirements of bid documents Construction scheme x4 Whether construction organization scheme is advanced, reasonable, and complete (x41) Quantity and qualification of the project’s main management and engineering technicians (x42) Equipment, financial resources, and manpower input in the project are reasonable or not (x43) Whether technical measures are safe and reliable or not (x44) Whether quality assurance measures are reasonable, normal, and perfect (x45) Corporate reputation and performances x5 Performance conditions of construction contracts
[3]Qian Jiazhong, Lv Chun, and Zhao Weidong, Joural of System Engineering Theory and Practice, 2010 (1):145-150
Joural of Economic Forum, 2010 (3): 203-204
Online since: January 2021
Authors: Tadashi Nishihara, Takahiro Ohashi, Hamed Mofidi Tabatabaei
Mechanical Joining Utilizing Friction Stir Forming
Takahiro Ohshi1,a*, Tadashi Nishihara1,b, and Hamed Mofidi Tabatabaei1,c
1School of Science and Engineering, Kokushikan University, 4-28-1 Setagaya, Setagaya-ku,
Tokyo 154-8515 Japan
atohashi@kokushikan.ac.jp, bnisihara@kokushikan.ac.jp, cmofidi@kokushikan.ac.jp
Keywords: mechanical joining, friction stir welding, friction stir processing, friction stir forming, dissimilar materials
Abstract.
Engineers in the automobile industry will eventually focus their attention on the methodology of dissimilar materials joining.
(AS advancing side, RS retreating side) [11].
Forum, 426-432 (2003) 2971-2978
Nishihara, Friction Stir Forming for Mechanical Interlocking of Ultra-Thin Stainless Steel Strands and Aluminum Alloys, Defect and Diffusion Forum 382 (2017) 114-119
Engineers in the automobile industry will eventually focus their attention on the methodology of dissimilar materials joining.
(AS advancing side, RS retreating side) [11].
Forum, 426-432 (2003) 2971-2978
Nishihara, Friction Stir Forming for Mechanical Interlocking of Ultra-Thin Stainless Steel Strands and Aluminum Alloys, Defect and Diffusion Forum 382 (2017) 114-119
Online since: September 2008
Authors: Makoto Kitabatake, M. Tagome, S. Kazama, K. Yamashita, K. Hashimoto, Kunimasa Takahashi, O. Kusumoto, Kazuya Utsunomiya, Masashi Hayashi, M. Uchida, R. Ikegami, C. Kudo, S. Hashimoto
Hashimoto
Advanced Device Development Center, Matsushita Electric Industrial Co., Ltd.
3-1-1 Yakumo-naka-machi, Moriguchi, Osaka, 570-8501, Japan
Email: kitabatake.makoto@jp.panasonic.com
Keywords: MOSFET, normally off, Ron, switch, DC-DC converter
Abstract.
Bayne, in: Advances in Silicon Carbide processing and Applications, edited by S.
Stephani, Materials Science Forum Vols. 527-529 (2006) p. 1255
Pantelides, et. al., Materials Science Forum Vols 527-529 (2006) p.935
Kitabatake, et. al., Microelectronic Engineering 83 (2006) p. 135
Bayne, in: Advances in Silicon Carbide processing and Applications, edited by S.
Stephani, Materials Science Forum Vols. 527-529 (2006) p. 1255
Pantelides, et. al., Materials Science Forum Vols 527-529 (2006) p.935
Kitabatake, et. al., Microelectronic Engineering 83 (2006) p. 135
Online since: September 2011
Authors: Jing Tang, Yi Zhang
Trends of Rabbit Hair Industry in 2011
Jing Tang1,2,a, Yi Zhang1,2,b
1Key Laboratory of Advanced Textile Composites, The School of Textiles, Tianjin Polytechnic University, Tianjin 300160, China
2Processing and Comprehensive Research Center of Rabbit Modern Agricultural Industry Technology System, Tianjin 300160.
China atangjing3368@sina.com, btianjinzhangyi@126.com Keywords: Textile engineering, Rabbit hair industry, Trends.
For instance, 194 participants appeared in Chinese rabbit industry forum and rabbit product fair in Linyi, Shandong Province 2010 to exhibit their studrabbit, rabbit hutch and feed.
China atangjing3368@sina.com, btianjinzhangyi@126.com Keywords: Textile engineering, Rabbit hair industry, Trends.
For instance, 194 participants appeared in Chinese rabbit industry forum and rabbit product fair in Linyi, Shandong Province 2010 to exhibit their studrabbit, rabbit hutch and feed.
Online since: April 2010
Authors: O. Taguchi, D.Y. Park, G.S. Shin, Ryusuke Nakamura, C.G. Lee, Shigeru Suzuki
Nakamura3
1
School of Nano and Advanced Materials Engineering, Changwon National University, Gyeongnam
641-773, Korea
1*Student, School of Nano and Advanced Materials Engineering, Changwon National University,
Gyeongnam 641-773, Korea
2
Institute of Multidisciplinary Research for Advanced Materials, Tohoku University, Sendai
980-8577, Japan
3
The institute of Scientific and Industrial Research, Osaka University,
Ibaraki 567-0047, Japan
Keywords: Pb free solder, Sn-Ag alloy, layer thickness, growth rate constant, diffusion
Abstract.
Berger: Defect Diffusion Forum Vols. 194-199 (2001), p. 1575
Berger: Defect Diffusion Forum Vols. 194-199 (2001), p. 1575