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The diffusion of gaseous molecules through the grain boundaries of the organic active layer into the channel region is critical.
A number of methods has been developed to improve electrical conductivity and sensitivity of OTFTs, such as doping carbon nanotubes (CNTs) or using metal oxide materials, etc[6,7].

M— Nickel ions or Manganese ions; L—chelating molecules; n—chelating number; β1，β2，βn—chelating equilibrium constant; Table 1, The reaction equation and equilibrium constant in the solution No Equation lgKβ 1 NH3+H+=NH4+ lgKah=9.27 2 H2O=H++OH- lgKw=-14.0 3 Ni(OH)2(s)=Ni2++2OH- lgKspnh=-13.7 4 Ni2++OH-=Ni(OH)+ lgKnh1=3.97 5 Ni2++2OH-=Ni(OH)20 lgKnh6=7.55 6 Ni2++3OH-=Ni(OH)3- lgKnh3=11.33 7 2Ni2++OH-=Ni2(OH)3+ lgKnh5=3.3 8 Ni2++NH3=Ni(NH3)2+ lgKnn1=2.8 9 Ni2++2NH3=Ni(NH3)22+ lgKnn2=4.04 10 Ni2++3NH3=Ni(NH3)32+ lgKnn3=5.77 11 Ni2++4NH3=Ni(NH3)42+ lgKnn4=6.96 12 Ni2++5NH3=Ni(NH3)52+ lgKnn5=2.71 13 Ni2++6NH3=Ni(NH3)62+ lgKnn6=2.74 14 Mn(OH)2(s)=Mn2++2OH- lgKspmh=-12.8 15 Mn2++OH-=Mn(OH)+ lgKnh1=3.4 16 Mn2++3OH-=Mn(OH)3- lgKnh2=7.3 17 2Mn2++OH-=Mn2(OH)3+ lgKnh4=3.4 18 2Mn2++3OH-=Mn(OH)3+ lgKnh5=17.1 19 Mn2++NH3=Mn(NH3)2+ lgKmn1=1.0 20 Mn2++2NH3=Mn(NH3)22+ lgKmn2=1.54 21 Mn2++3NH3=Mn(NH3)32+ lgKmn3=1.70 22 Mn2++4NH3=Mn(NH3)42+ lgKmn4=1.30 The relations in co-precipitation system are as follows
So, when pH=11 and [NH3]=0.8-1mol/L, the morphology of Ni1/2Mn1/2(OH)2 is the best, and the total ammonia concentration in the reactor close to 0.4mol/L at this moment; when the ammonia concentration is lower, the particle size of formed Ni1/2Mn1/2(OH)2 is smaller and prone to agglomeration, the particles are large; while the ammonia concentration is higher, nickel ion and ammonia is easily formed complex and the precipitation is incomplete and the speed of grain growth is slow.

Introduction Powder metallurgy includes a number of steps, to produce parts with varied characteristics.
For high-pressure values, the contact surfaces expand, the grains deform plastically and the porosity rate in the final compact is insignificant.

Owing to the high cooling rate, these components have extremely fine cellular dendrites with Laves phase precipitating in the sub-grain boundaries according to the nature of SLM process [[] M.
Tensile samples show a greater number of fine needle-like γ′′ phases (Fig.8a), while compression samples show some larger size δ precipitates (Fig.8b).

In this research the effect of aggregate gradation on concrete permeability has been examined using a number of laboratory test results.
Fig. 3 is an individual percent retained curve (IPR), which shows the grain size distribution for both of the selected aggregate gradations with respect to “8-22” distribution.

For each test series there is a settled number of four probes.
Above all the SLM process, the chosen geometry of the to be printed object, the grain size and as a result of process failures cause those issues.

Numbers going from 1 to 5 indicate the boundary conditions for calculating the transmittance of water vapor diffusion.
Symbol A means soft wood (flow perpendicular to the grain) and symbol B means thermal insulation.

Because of a number of desirable physical and chemical properties exhibited compared with traditional molecule sieve materials such as high surface area and pore volume, high thermal stability and ease of surface modifications, mesoporous materials afford many potential application of chromatography, cosmetics, catalyst, and adsorption, and is expected to play a tremendous role in material science in the future [3].
For PEG-6000, it might be joined with CTAB in some way and worked as dispersing agent to suppress growth of grains.

In addition, water or other fluids may affect the wear rate of a material by a number of mechanisms, primarily (although not exclusively) as agents of corrosion and/or lubrication [5].
This would be rational if one notices that, aside from the factors such as hardness, toughness, carbide grain size, phase distribution, binder phase content, and microstructure, the testing conditions including the counterpart material could also have prominent effects on the friction and wear behavior of the WC-Co coating [3,6,8].

Table 2 Microhardness of electroless Ni-P deposit Hardness (HV) Ponit number 1 2 3 4 5 Average value Without heat treatment 699.1 774.8 707.7 691.1 739.3 722.4 With heat treatment at 400 o C 968.8 1002.7 985.4 958.2 978.6 978.7 3.3 Immersion tests The corrosion rate of W-Cu substrate and Ni-P deposit in different corrosion mediums are shown in Fig.3.
The SEM result shows that the Ni-P alloy deposit has a fine-grained structure with a uniform distribution.