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Direct property indexes included material, fiber count, structure, weight, density, thickness and loop length.
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Yeung: submitted to Journal of Textile Research Journal (2004)

Computational Materials Science 92 (2014), pp. 305-312
Computational Materials Science 89 (2014), pp. 233-241
Materials Science Forum 753 (2013), pp. 113-116
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In this session, a general stress modelling was developed based on the following basic assumptions: (1) materials involved, including pure metals and their solid solution, were isotropic and linearly elastic [14], (2) temperature was constant during the interdiffusion of materials, and (3) interdiffusion of materials resulted in solid solution only.
Therefore, this quantity could be estimated from its chemical compositions and the CTEs of pure materials.
[5] Breach, C.D., Wulff, F.W., A brief review of selected aspects of the materials science of ball bonding, Microelectronics Reliability, 50(1) (2010) 1-20
[6] Du, X., Wang, W., Ding, Z., Wang, X., Qiao, Y., Wei, S., Zhu, Q., Guo, J., Effect of Cu/Ga interfacial reaction on heat transfer performance, Journal of Materials Science: Materials in Electronics, 34 (2023) 1336
[11] Xiong, Y., Hu, W., Shu, Y., Luo, X., Zhang, Z., He, J., Yin, C., Zheng, K., Atomistic simulation on the generation of defects in Cu/SiC composites during cooling, Journal of Materials Science & Technology, 123 (2022) 1-12 [12] Grams, A., Jaeschke, J., Wittler, O., Fabian, B., Thomas, S., Schneider-Ramelow, M., FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics, Microelectronics Reliability, 111 (2020) 113683

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Component dimensions and material properties are shown in Table1, and all parameters are independent of temperature and time.
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Where, I: incident wave, R: reflection wave, T: transmitted wave;σis the stress in the inner material If both materials are identical then the reflection coefficient is zero and all ultrasonic is transmitted.
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