Effect of Contact Interface on Ultrasonic Characteristic of Wire Bond Transducer

Zhan Hui Li; Yun Xin Wu; Zhi Li Long

doi:10.4028/www.scientific.net/AMR.139-141.2350

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 139-141Effect of Contact Interface on Ultrasonic...

Effect of Contact Interface on Ultrasonic Characteristic of Wire Bond Transducer

Abstract:

For improving the bonding strength of chip and vibration stability, propagation characteristics of ultrasonic wave across contact interface in wire bonding transducer was investigated in this paper. The rough contact interface is studied. The propagation characteristic is equivalent to the spring-mass model. The spring-mass model of ultrasonic propagation through contact interface was established. The reflection coefficient and transmission coefficient of ultrasonic is related to the stiffness of the contact interface. Aluminum wire bond experiments were performed on a laboratory test bench. The vibration velocities of the capillary and bond strength of chip were obtained at different tightening torque. The results show that the tightening torque in a moderate condition can the highest velocity of capillary and the largest bond strength be reached. Measuring of velocity of capillary can be a method of forecasting the bond strength of chip

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Periodical:

Advanced Materials Research (Volumes 139-141)

Pages:

2350-2353

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.139-141.2350

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Online since:

October 2010

Authors:

Zhan Hui Li, Yun Xin Wu, Zhi Li Long

Keywords:

Contact Interface, Nonlinear, Ultrasonic Propagation, Ultrasonic Transducer, Wire Bond

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