Effect of Contact Interface on Ultrasonic Characteristic of Wire Bond Transducer

Abstract:

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For improving the bonding strength of chip and vibration stability, propagation characteristics of ultrasonic wave across contact interface in wire bonding transducer was investigated in this paper. The rough contact interface is studied. The propagation characteristic is equivalent to the spring-mass model. The spring-mass model of ultrasonic propagation through contact interface was established. The reflection coefficient and transmission coefficient of ultrasonic is related to the stiffness of the contact interface. Aluminum wire bond experiments were performed on a laboratory test bench. The vibration velocities of the capillary and bond strength of chip were obtained at different tightening torque. The results show that the tightening torque in a moderate condition can the highest velocity of capillary and the largest bond strength be reached. Measuring of velocity of capillary can be a method of forecasting the bond strength of chip

Info:

Periodical:

Advanced Materials Research (Volumes 139-141)

Edited by:

Liangchi Zhang, Chunliang Zhang and Tielin Shi

Pages:

2350-2353

DOI:

10.4028/www.scientific.net/AMR.139-141.2350

Citation:

Z. H. Li et al., "Effect of Contact Interface on Ultrasonic Characteristic of Wire Bond Transducer", Advanced Materials Research, Vols. 139-141, pp. 2350-2353, 2010

Online since:

October 2010

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Price:

$35.00

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