Search results

This material is widely used in many engineering disciplines for welded constructions.
(a) (b) Figure 2 (a) Macrograph of the weld; (b) Hardness distribution of the weld (HV1) Many engineering disciplines rely on fatigue strength evaluation based on nominal stresses.
E.g. [11] show that this effect should be considered in advanced fatigue design concepts.
Schönborn, Effects of Residual Stresses on the Fatigue Performance of Welded Steels with Longitudinal Stiffeners, Materials Science Forum, Vols. 768-769, pp. 636-643, 2013
Edwards, Influence of Residual Stress Redistribution on Fatigue Crack Growth and Damage Tolerant Design, Materials Science Forum, Vols. 524-525, pp. 363-372, 2006

Acknowledgements The Department of Science and Technology (DST) in South Africa is acknowledged for funding under the Advanced Metals Initiative Program.
Eberl, The effect of silver on microstructural evolution in two 2xxx series Al-alloys with a high Cu:Mg ratio during ageing to a T8 temper, Material Science and Engineering A 491 (2008) 214 – 223
Zeng, Enhanced mechanical properties in an Al-Cu-Mg-Ag alloy by duplex ageing, Materials Science and Engineering A 528 (2011) 8060 – 8064
Bes, Damage tolerance of an Al-Cu-Mg-Ag alloy (2139), Materials Science Forum, Vols. 519-521 (2006) pp603-608
Govender, Optimisation of the solution heat treatment of rheo-processed Al-Cu-Mg-(Ag) alloys A206 and A201, Materials Science Forum Vols. 618-619 (2009) pp 353-356

Acknowledgment Financial support by the FUNMAT program at the University of Oslo and the Norwegian Research Council (strategic university program on advanced sensors) is gratefully acknowledged.
Pensl: Silicon Carbide: Recent Major Advances, Springer Series, Advanced Texts in Physics (2004)
Engineering Vol.72 (2004), p. 326 [8] M.
Forum Vol. 483-485 (2004), p. 705 [9] M.

It is the aim of the Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM) to provide a forum to discuss the recent progresses, exchange ideas, and boost the cooperation among the researchers, graduates and entrepreneurs from across the Asia-Pacific region.
As many as 45 invited talks and 26 contributed presentations were given, providing a stimulating overview of the latest advances in wide bandgap semiconductors technology.
China) Wei HUANG (Fudan University, China) Chih-Fang HUANG (National Tsing Hua University, Taiwan, China) Fengyi JIANG (Nanchang University, China) Peng JING (Institute of Semiconductors, CAS, China) Sooseong KIM (TRinno technology, Korea) Zhanping LAI (The 46th Research Institute of China Electronic Technology Group Corporation, China) Chwan-Ying LI (Hestia Power Inc., Taiwan, China) Kung-Yen LI (National Taiwan University, Taiwan, China) Shunfeng LI (Dongguan Institute of Opto-Electronics Peking University, China) Bingbing LIU (Jilin University, China) Calvin LIU (Globalwafers Co., Ltd., Taiwan, China) Guoyou LIU (Zhuzhou CRRC Times Electric Co., Ltd., China) Xinyu LIU (Institute of Microelectronics, CAS, China) Xuechao LIU (Shanghai Institute of Ceramics, CAS, China) Guoquan LU (Virginia Tech., USA) Hideharu MATSUURA (Osaka Electro-Communication University, Japan) Tokuyasu MIZUHARA (ROHM Semiconductor (Shanghai) Co., Ltd., Japan) Puqi NING (Institute of Electrical Engineering
, CAS, China) Chulmin OH (Korea Electronic Technology Institute, Korea) Tonghua PENG (TankeBlue Semiconductor Co., Ltd., China) Yufeng QIU (Global Energy Internet Institute, China) Mark RAMM (STR Group, Inc., Russia) Bo SHEN (Peking University, China) Guosheng SUN (Institute of Semiconductors, CAS, China) Tadatomo SUGA (Meishi University, Japan) Koukou SUU (ULVAC, Inc., Japan) Weihua TANG (Beijing University of Posts and Telecommunications, China) Jinyan WANG (Peking University, China) Junxi WANG (Institute of Semiconductors, CAS, China) Xuhui WEN (Institute of Electrical Engineering, CAS, China) Ke XU (Suzhou Nanowin Technology Co., Ltd., CAS, China) Kouji YAMAGUCHI (Fuji Electric Co., LTD., Japan) Anping ZHANG (Xi'an Jiaotong University, China) Degang ZHAO (Institute of Semiconductors, CAS, China) Q.

Effects of Nd on Mechanical Properties of Magnesium Alloy AZ91 Huizhen Jianga, Quan-an Li, Xiaoya Chen, Leilei Chen School of Materials Science and Engineering, Henan University of Science and technology, Luoyang 471023, China aemail: jhzjiayou@163.com Keywords: Nd; Magnesium Alloy; Microstructure; Mechanical Propertie Abstract.
The phase analysis of the alloys was completed by D8 Advance X-ray diffract meter (XRD).
Materials Science and Engineering A, Vol. 302(2001), p. 37
Materials Science Forum, Vol. 419-422(2003), p. 57

Microstructure and properties of TiAlN compound films fabricated on AZ91D alloy by magnetron sputtering Sheng LU1a, Liangwen WU1b and Jing CHEN2c 1School of Materials Science and Engineering; Jiangsu University of Science and Technology, Zhenjiang, 212003, Jiangsu, China 2School of Mechanical Engineering; Jiangsu University of Science and Technology, Zhenjiang, 212003, Jiangsu, China alusheng119@yahoo.com.cn, bwlw_mail@yahoo.com.cn, cchenjing0612@yahoo.com.cn Keywords: TiAlN film, magnetron sputtering, magnesium alloy, corrosion.
Acknowledgment The present work was supported by the key laboratory of advanced welding technology of Jiangsu Province, China, grant No.
Clow: Advanced Materials and Processes Vol. 150 (4) (1996), p. 33
Ebert: Materials Science and Engineering A Vol. 302 (1) (2001), p. 37
Liu: Material science forum Vol. 561-565 (2007), p. 1185

Advanced Materials Research. 750-752(2013) 583-586
Materials Science and Engineering, A. 302(2001) 47-52
Materials Science and Engineering, B. 127(2006) 105-107
Mater Sci Forum.419-422(2003) 473—478
Advanced Materials Research..352(2011) 239-242

Rheology Assessment of PSf/ NMP Solution and its Influence on Membrane Structure Priscila Anadãoa, Rafael Rezende Montesb, Henrique Souza de Santisc and Hélio Wiebeckd Department of Metallurgical and Materials Engineering, School of Engineering, University of São Paulo, 05508-900, Brazil apriscila.anadao@gmail.com (corresponding author), b rrmontes85@gmail.com, c souzadesantis@yahoo.com.br, dhwiebeck@usp.br Keywords: polysulfone, membrane, wet-phase inversion method, molar mass.
Polysulfone (PSf) is widely used as an engineering thermoplastic material to fabricate membranes for applications in microfiltration, ultrafiltration, reverse osmosis and gas separation [4-6].
Experimental Polysulfone (PSf) Udel® P-1700 and Udel® P-3500, whose Mw* are 62973 and 71526, respectively, were kindly supplied by Solvay Advanced Polymers.
Authors are thankful to Solvay Advanced Polymers for giving polysulfone Udel® P-1700 and P-3500.
Forum Vol. 660-661 (2010), p. 1081

Kladas, Journal of Optoelectronics and Advance Materials, Vol. 10, pp. 1103-1105, 2008
Kladas, Material Science Forum, TTP, Vol. 670, pp. 51-59, 2011
Moses, Journal of Materials Engineering and Performance, Vol. 1 (2), pp. 235-244, 1992
Enokizono, Material Science Forum, TTP, Vol. 670, pp. 447-454, 2011
Enokizono, Material Science Forum, TTP, Vol. 721, pp. 90-95, 2012

XPS Studies on ZrO2 Thin Films Deposited on Glass Substrate by Sol-Gel Xingang Yu1a, Yi Gong 1, Wenyue Bi1, Xuechun Tian 1, Hongwen Ma2b, Huifeng Zhao3c, Guohong Qiu and Li Wang3 1 College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China 2 Department of Material Science, China University of Geosciences Beijing, 100083, China 3 Research Institute of Glass and Glass Fiber, China Building Materials Academy Beijing, 100024, China a yu_xin_gang@163.com, bmahw@cugb.edu.cn, czhao-73@tom.com Keyword: XPS, ZrO2-CeO2 thin films, Sol-gel Abstract: The chemical composition and the valence state of elements on the surface of ZrO2 thin films deposited on glass substrates have been studied by X-ray photoelectron spectroscopy.
Acknowledgement This work was supported by the Foundation of Key laboratory of new processing technology for nonferrous metals and materials, ministry of education, and Guangxi key laboratory for the advance materials and new preparation technology, Guilin, Guangxi, China.
Forum Vol. 475-479 (2005), p. 1647