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Online since: February 2014
Authors: Naruhisa Miura, Masayuki Imaizumi, Masayuki Furuhashi, Toshikazu Tanioka, Satoshi Yamakawa
Ozeki, Characteristics of 4H-SiC MOS interface annealed in N2O, Solid-State Electronics 49 (2005) 896-901
Online since: August 2012
Authors: Dong Pyo Hong, Sung Mo Yang, Joon Hyuk Song, Hee Yong Kang, Hyo Sun Yu, Gyun Lee
McCloskey, and S.C O’Mathuna, “Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders”, Microelectronics Reliability 46, (2006), pp. 896-904
Online since: December 2011
Authors: S.M. Mizanoor Rahman, Ryojun Ikeura, Soichiro Hayakawa, Hao Yong Yu
Naratani, “Simulation of a pneumatic hand crane power-assist system,” Journal of Robotics and Mechatronics, Vol.20, No.6, 2008, pp. 896-902
Online since: February 2011
Authors: Wen Liu, Xianyi Li, Xuan Pu Dong, Zi Tian Fan, Ji Qiang Li
Vol.54 (2006), PP.893-896
Online since: February 2007
Authors: James M. Buchanan
There are 896 male and 1392 female "hips" in the series.
Online since: July 2011
Authors: Xu Dong Lu, Ce An Guo, Jie Wang, Shu Wu Ma
Met. 16( 2006) 896-897
Online since: September 2012
Authors: Yu Can Fu, Lan Ying Ding, Jie Wu, Yan Chen, Kai Chen
It is a forgiving alloy to work with, is normally used at a minimum tensile strength of 896 MPa, has good fatigue and fracture properties (which can be optimized through heat treatment) and is used in all product forms including forgings, bar, castings, foil, sheet, plate, extrusions, tubing and fasteners [1].
Online since: January 2013
Authors: Min Li Bai, Zhi Hai Kou, Hong Wu Yang
When the heat load increases from 12 W to 30 W, the equivalent thermal conductivity keff increases from 896 W/(mK) to 1078 W/(mK).
Online since: January 2014
Authors: Yuan Chao He, Wen Lin Chen, Li Na Hao
A simple evolutionary procedure for structure optimization [J], Computers and structures, 49(5): 885-896. (1993)
Online since: June 2011
Authors: Hang Jun Wang, Ling Jun Sun, Tian Long Xu
References [1] WANG Hang-jun    ZHANG Guang-qun    QI Heng-nian    LI Wen-zhu: A review of research on wood recognition technology, JOURNAL OF ZHEJIANG FORESTRY COLLEGE,26(6):896-902