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Online since: August 2012
Authors: Dong Pyo Hong, Sung Mo Yang, Joon Hyuk Song, Hee Yong Kang, Hyo Sun Yu, Gyun Lee
McCloskey, and S.C O’Mathuna, “Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders”, Microelectronics Reliability 46, (2006), pp. 896-904
Online since: September 2012
Authors: Yu Can Fu, Lan Ying Ding, Jie Wu, Yan Chen, Kai Chen
It is a forgiving alloy to work with, is normally used at a minimum tensile strength of 896 MPa, has good fatigue and fracture properties (which can be optimized through heat treatment) and is used in all product forms including forgings, bar, castings, foil, sheet, plate, extrusions, tubing and fasteners [1].