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Numerical Analysis of the Schottky Contact Properties on the Forward Conduction of MPS/JBS SiC Diodes Marco Boccarossaa *, Alessandro Borgheseb, Luca Marescac, Michele Ricciod, Giovanni Breglioe and Andrea Iracef Department of Electrical Engineering and Information Technologies (DIETI), University of Naples Federico II, Naples, Italy a*marco.boccarossa@unina.it, balessandro.borghese@unina.it, cluca.maresca@unina.it, dmichele.riccio@unina.it, egiovanni.breglio@unina.it, fandrea.irace@unina.it Keywords: MPS diode, JBS diode, Schottky contact, Ohmic contact, TCAD simulation, Snapback.
Baliga, Advanced Power Rectifier Concepts.
Roccaforte et al., “Metal/Semiconductor Contacts to Silicon Carbide: Physics and Technology,” Materials Science Forum, vol. 924, pp. 339–344, 2018, doi: 10.4028/WWW.SCIENTIFIC.NET/MSF.924.339

Microstructure and Aging Behavior of Al-0.2wt%Zr Alloy Heavily Deformed by ARB Process Takatoshi Sato 1, a, Daisuke Terada1, b , Nobuhiro Tsuji1,c 1 Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka, 565-0871, JAPAN a takatoshi.sato@ams.eng.osaka-u.ac.jp, bterada@ams.eng.osaka-u.ac.jp, c tsuji@ams.eng.osaka-u.ac.jp Keywords: aluminum, zirconium, solid solution, sever plastic deformation, accumulative roll-bonding (ARB), microstructure, aging, precipitation Abstract.
Acknowledgements This study was financially supported by the Grant-in-Aid for Scientific Research or Priority Areas, "Giant Straining Process for Advanced Materials Containing Ultra-High Density Lattice Defects", though the Ministry of Education, Culture, Sports, Science and Technology of Japan.
Forum (2003) [4] "Recrystallization and Related annealing Phenomena" F.J.

.: Characterization of the drapability on non-crimp fabrics, Society for the Advancement of Material and Process Engineering: New Materials and Processes for a New Economy, SAMPE 2010, Seattle, WA. - Covina, CA, 17. - 20.05.2010, 55th International SAMPE Symposium Seattle: SAMPE Publishing, 2010 [3] DIN 53362, Bestimmung der Biegesteifigkeit, Verfahren nach Cantilever, 2003 [4] J.
(Ed.): New Material Characteristics to cover New Application Needs: SEICO 11; SAMPE Europe 32nd International Technical Conference & Forum, March 28th - 29th, 2011, Paris; pp. 450-455 [8] Friebe, H.; Galanulis, K.; Klein M.: Numerical comparison and verification of FEA in sheet metal forming by optical measurements of large and complex parts.
Galanulis: Optical measuring technologies in sheet metal processing”, Proceedings of SheMet (05./08.04.2005), Advanced Materials Research Vols. 6-8 (May 2005) pp. 19-34, Trans-TechPublications [10] Schnabel, A.; Gries, T.: Production of non-crimp fabrics for composites, In: Lomov, S.

Therefore, they have currently strong scientific interest and alluring potential for a number of engineering applications.
Forum 331-333 (2000) 1107-1112
Proceedings "Advanced Metallic Materials", Smolenice, Slovakia, 2003, pp. 5-15

The 2016 Conference on Fundamental and Applied Science for Advanced Technology (ConFAST 2016) AIP Conference Proceedings, 1746, (020028).
Materials Science Forum, 827, 229-234
IOP Conference Series Material Science Engineering, 202, 12013

Heimann, Classic and advanced ceramics: from fundamentals to applications, John Wiley & Sons (2010)
Naginskii, Modern Building Materials Using Waste from the Dismantling of Buildings and Structures Materials Science Forum Trans Tech Publications Ltd.
Tsozué D et al, Mineralogical, physico-chemical and technological characterization of clays from Maroua (Far-North, Cameroon) for use in ceramic bricks production, Journal of Building Engineering.

The devices with the silicon IGBTs are commercially available (SKiiP 13AC12T4V1), and the SiC MOSFET modules are engineering samples, but were manufactured with the same packaging technology.
Hence, the difference in H3TRB cannot necessarily be attributed to the semiconductor properties but is likely a result of the advanced JT design of state-of-the-art power electronic devices.
Materials Science Forum, vol. 924.

Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint During Aging Jeong-Won Yoon a and Seung-Boo Jungb School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea a jwy4918@skku.edu, bsbjung@skku.ac.kr Keywords: Pb-free solder, Sn-Ag solder, electroless nickel-immersion gold (ENIG), interfacial reaction, Aging Abstract.
Forum Vol. 510-511 (2006), p. 554 [2] M.

Acoff, Using cold roll bonding and annealing to process Ti/Al multi-layered composites from elemental foils, Materials Science and Engineering A, 379 (2004) 164-172
Shevtsova, Influence of the explosively welded composites structure on the diffusion processes occurring during annealing, in: 8th International Forum on Strategic Technology 2013, IFOST 2013 - Proceedings, 2013, 183-186
Ipser, Phases and phase relations in the partial system TiAl3-TiAl, Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques, 81 (1990) 389-396

Dopant Effect on the High-temperature Grain Boundary Sliding in Alumina Hidehiro Yoshida 1, Katsuyuki Matsunaga2, Takahisa Yamamoto 1, Yuichi Ikuhara 2 and Taketo Sakuma 1 1 Department of Advanced Materials Science, School of Frontier Science, The University of Tokyo. 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656 Japan.
E-mail: sakuma@ceramic.mm.t.u-tokyo.ac.jp 2 Institute of Engineering Innovation, The University of Tokyo. 2-11-16, Yayoi, Bunkyo-ku, Tokyo 113-8656 Japan.
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