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Cooperative Learning Basic Model in the Network Construction Jiajun Liu1, Xiaoyan Jiao2, Shouyi Liu3 1Hebei Institute of Architecture and Civil Engineering, Zhangjiakou City, Hebei Province, 075000, China 2College of Science, Hebei North University, Zhangjiakou City, Hebei Province, 075000, China 3Hebei North University, Zhangjiakou City, Hebei Province, 075000, China Keywords: information age, network environment, online learning, cooperative learning Abstract.
In addition, learners can also collaborate to study by e-forums, real-time chat, online chat, virtual reality, real-time communication with learners around the world to communicate, and so on.
Students can view assignment information and reference materials from teachers on the group task Web page, finishing their assignments within the prescribed time, the timely submission of group assignments, viewing the marks given by teachers. ③Organizing forum.
The purpose of the reform foreign language teaching is integrated with advanced computer technology to make technology positive and meaningful activities in foreign language learning services, to support and encourage collaborative learning.
With advanced technology, students are changed to explorers from passive recipients of knowledge.

Preface The 7th International Conference on Advanced Materials Research (ICAMR 2017, January 20-22, 2017, Hong Kong, China) is the interdisciplinary forum on all aspects of advanced materials encompassing physics, chemistry, material science and engineering and bio-technological disciplines.
It facilitates the exchanges of ideas, novel and practical techniques and applications in various fields of advanced materials including also composite materials and nanomaterials, chemical and materials engineering, nanotechnology etc.
Krishnamurthy, The National Institute of Engineering, India Dr.
Mohamed Haneef, Ghousia College of Engineering, India Dr.
Shanmugasundaram, Muthayammal College of Engineering Rasipuram, India Sponsor "American Elements, global manufacturer of advanced materials for process engineering in automotive, aerospace, energy, defense, & biotech industries"

We have built an advanced model on the basis of our model [15-17] to calculate the SID coefficients.
Philibert, Metal Physics and Advanced Technologies 21 (1999) 3
Forum 143-147 (1997) 177
Forum 194-199 (2001) 49
Forum 277 (2008) 125

Materials Science Forum Vols. *** (2004) pp.779-783 online at http://scientific.net  2004 Trans Tech Publications, Switzerland Dispersion and Stability of Nanodiamond in Clean Oil X.Y.
Wang 2,d 1School of Materials Science and Engineering, Central South University, Changsha 410083 China 2 R&D, Changsha Research Institute of Mining and Metallurgy, Changsha 410012 China 3 Department of Precision Instruments and Mechanology, Tsinghua University, Beijing,100084 China a xiangyang.xu@sohu.com, bzhiming@mail.csu.edu.cn, cy.w.zhu@263.net, dwangbc@crimm.cn Keywords: Nanodiamond, Clean oil, Deagglomeration, Dispersion, Mechanochemical modification Abstract.
Clean-oil-based nanodiamondferrous suspension can be used for some advanced material processing fields such as ultrafine polishing of magnetic head on hard disk in computer industry, as ND can reduce dramatically and sufficiently the roughness of the operating surface to sub-nano scale.
Clean oil with the viscosity around Advances in Materials Manufacturing Science and Technology 780 5 mm2 ·s-1(40�) was adopted as suspension medium.
Excellent deagglomeration Materials Science Forum Vols. *** 783 effect can therefore be actualized using this technique.

Saddow 1 1 Electrical Engineering Dept., University of South Florida, Tampa, Florida 33620, USA 2 Caracal Inc., 611 Eljer Way, Ford City, Pennsylvania 16226, USA Keywords: homo-epitaxy, hot-wall, CVD Abstract.
Forum 389-393 (2002), p. 179 [2] K.
Forum 433-436 (2003), p. 161 [3] A.
Forum 338-342 (2000), p. 131 [4] O.
Agarwal, Advances in Silicon Carbide Processing and Applications (Artech House, Inc., Norwood 2004)

Janzén, Microelectronic Engineering 86 (2009) 1194
Saddow, Silicon Carbide Biotechnology - A Biocompatible Semiconductor for Advanced Biomedical Devices and Applications, Elsevier, 2011
Computational Materials Science and Surface Engineering 2, No. 3-4 (2009) 227
Cheung, Materials Science Forum 711 (2011) 43
Alquier, Microelectronic Engineering 105 (2013) 65.

Module 3: Engineering and design.
Power Technology and Engineering.
Power Technology and Engineering.
Advanced Materials Research.
Advanced Materials Research.

It can be used to select the optimal shape parameters of the pintle nozzle quickly, which has certain engineering application value．
It is feasible to optimize the contour of the pintle nozzle quickly, which is potential in engineering application．
Forum Vo4. 12-15 (2002) [2].
Forum Vo4. 77-80 (2008) [6].
Advanced Rocket Nozzles, Journal of Propulsion and Power, 14, 620-634 (1998)

Materials Science Forum Vols. *** (2004) pp.448-452 online at http://scientific.net  2004 Trans Tech Publications, Switzerland Plasma-particle Interaction in Spray Forming J.C.
Zhao 1,c 1 College of Mechanical Engineering and Automation, HQU, Quanzhou 362011 P.R.
China 2 School of Mechanical Engineering, DUT, Dalian 116023 P.R.
Materials Science Forum Vols. *** 449 Imaging of Plasma Jet Plasma is the direct energy source when the powders are heated in the plasma jet.
Materials Science Forum Vols. *** 453 References [1] S.

In the current study, the standard two-equation k–ω of shear stress transport model is used for turbulence with buoyancy modifications, because of its wide application in engineering problems and its validation pedigree for wall heat transfer applications [13,15].
Hamed: A Comparative Study of Turbulence Models Performance for Turbulent Flow in a Planar Asymmetric Diffuser, World Academy of Science, Engineering and Technology 53 (2009) [8] SEL. 2000.
Jakovics: Research of Composite Constructions’ Impact on the Energy Efficiency of Buildings, 3rd International Conference Advanced Construction, Kaunas, Lithuania (2012) [11] S.V.
Spalding: Computer Methods in Applied Mechanics and Engineering Forum Vol. 3(1) (1974), p. 269–289 [13] G.
London, Series A Forum Vol. 356 (1748), p. 2835–2854 [14] K.B.