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Acknowledgements This research is supported by Laboratory-Based Education of Engineering Faculty-Hasanuddin University, 2021.
Louis, Indigenous Knowledge of Bamboo Products and uses in the Western Highlands of Cameroon, Asian Journal of Research in Agriculture and Forestry. (2021) 22–30
Abedom, Sound absorbing and insulating properties of natural fiber hybrid composites using sugarcane bagasse and bamboo charcoal, Journal of Engineered Fibers and Fabrics. 16 (2021) 1–10
Sun, Sound absorption properties of ceramic hollow sphere structures with micro-sized open cell, Materials Letters. 134 (2014) 268–271
Bruneau, The measurement of acoustic impedance at oblique incidence with two microphones, Journal of Sound and Vibration. 101 (1985) 130–132

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Influence of Mg and Si in the Aluminum on the Thermo-physical Properties of Pressureless Infiltrated SiCp/Al Composites Xianliang ZHOU, Aihua ZOU, Xiaozhen HUA, Jianyun ZHANG School of Materials Science and Engineering, NanChang Hangkong University, Nanchang, 330063, China a email:zhouxianliang@hotmail.com Key words: SiCp/Al Composite; Pressureless Infiltration; Coefficient of Thermal Expansion, Thermal Conductivity Abstract.
Some studies have been made to overcome this barrier, such as the addition of Mg and Si to the aluminum matrix, passive oxidation of SiC, utilization for N2 atmosphere and controlling of the infiltration time and temperature[12-15].Some experiments have been carried out to prepare the SiCp/Al composites by pressure infiltration, which has been reported that Mg contained in matrix may improve in the wettability between ceramics and metals, and that Si may prevent or retard the development of unwanted phases[16], but relatively little attention has been paid to the effect of Mg and Si in the aluminum on the thermo-physical properties of pressureless infiltrated SiCp/Al composites.As is shown that the key requirements for electronic packaging materials are a high thermal conductivity, a CTE similar to that of elements common to microelectronics systems, a high thermal dimensional stability and an appropriate strength [17].
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