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The Inverse Pole Figure (IPF) maps clearly show the elongation of grains and orientation gradients due to shear(Fig. 2).
The higher numbers of active slip system lead to lower plastic spin that contributes to slower texture evolution in tension and compression.
Irrespective of the strain rate, the deformed samples showed about 65% Low Angle Grain Boundaries and 35% High Angle Grain Boundaries.
The most important observation from the EBSD maps was the decrease in intra-granular misorientation parameters like Grain Average Misorientation (GAM), Grain Orientation Spread (GOS) and Kernel Average Misorientation (KAM) with increase in strain rate.
It is understood that higher numbers of slip system get activated at high strain rate leading to lower lattice spin.

The machining condition was determined based on the dimensionless numbers.
Definition of Dimensionless Numbers Relative Velocity Ratio VVR.
A resinoid bonded grinding wheel with a grain size #325 was used to perform rough grinding.
A vitrified bonded grinding wheel with grain size #8000 and concentration of 150 was used for the finish grinding.
This suggested that the abrasive grain was rubbed by the wafer surface.

The low angle grain boundaries (LAGBs) and high angle grain boundaries (HAGBs) are defined when 1°-15° and >15°, respectively.
The grain size of the sample is fine and uniform.
The mean grain size is 3.8 μm.
When the annealing temperature increases to 375°C, the average misorientation angle is increased to 15.58°, which indicates a increased number of DRX grains at high temperature
The grain size of extruded Al-Fe-(Cu) alloys were fine and uniform.

The process contains two parts; the first part is grain refinement and the second the creation of deformed grains with high density of fine particles to promote extended recovery.
Chan and Humphreys [6] found slow kinetics of recrystallisation and a microstructure consisting of large irregular grains and small island grains.
Volume fraction, particle length and number density of particles were measured using image processing software.
Although the alloy 0-1-1.2 also forms M2C particles, the number density of the particles in this alloy is much lower than that in the alloy 2-1-1.2.
High angle grain boundaries (HAGB) and low angle grain boundaries (LAGB) are drawn as black and white lines, respectively.

Journal Title and Volume Number (to be inserted by the publisher) 1 Microstructure and Texture Development during Recrystallization of Rolled Molybdenum Sheets I.
Recrystallization is an important tool to adjust the grain size and texture of polycrystalline materials in order to optimize their properties.
TD ND 4 Title of Publication (to be inserted by the publisher) isotropic grain growth in three dimensions is not fulfilled in the Mo sheets investigated.
Rosen et al. [6] reported a constant growth rate of the grain area for high purity iron.
The weak maxima on the γ-fibre change between {111}<110> and Journal Title and Volume Number (to be inserted by the publisher) 5 {111}<112> in a non-systematic way with annealing time.

To deal with the two problems, we did so much theoretical analysis and a large number of orthogonal experiments.
In the middle of the wall, the grain is plate grain shown in Fig.9 (b).
Its super-cooling degree is great and the effect of grain refining is obvious, as shown in Fig.9 (c).
In general, the wall has solid structure and small grain and the grain size has no obvious change.
(4) Micro-scoping the microstructure, the grain is fine and solid.

The formula for the number of hardness is as follows: HV=1854.4×Pd2
Those data values are determined by the number of negative charges produced.
The size of the number shows the material's tendency to oxidize.
A low Ecorr number will tend to corrode more easily, and vice versa.
Due of the slower cooling rate, which encourages grain growth.

Within individual grains, when boundary planes lay within 5° of {111} planes, the boundaries were classified as having crystallographic alignment within that grain.
The accuracy of determination of the direction of a boundary trace will depend on the number of map pixels between the triple junctions, (e.g. a 10 pixel line has an uncertainty of ~5o ).
• Orientation of the grains at the boundary.
Experimental investigation of boundary alignments We have used the techniques described above for a number of investigations, and a summary of some recent results is presented below.
The small variations measured in boundary alignment from grain to grain are thought to arise from the complex interactions of neighbouring grains, with perhaps some relatively minor and indirect influence of crystallography.

Meanwhile the presence of large number of surface and edge atoms provides active sites for catalyzing surface reactions.
These conditions are met by a number of combinations of chemicals and each combination has its own thermodynamic and kinetic considerations [12].
The average roughness value is about 9.6, 8.1 and 6.2 and the surfaces are smooth with globular grains.
In the second case, the minimum resistivity value is found for the films with larger grain size.
The larger the grain size, the smaller will be the grain boundary area and hence lower the scattering of charge carriers at the grain boundaries.

The crack is intergranular in coarse grained region, and ends at fine grained region of HAZ.
Fig.6 shows that there are many cavities partially distributed in grain boundary of coarse grained region.
There are no abnormal changes in grains.
Fig.3 .Crack tip point to coarse grained Fig.4 .Intergranular in coarse grained region region from fine grained region Fig.5.
Bunchy cavities in grain main crack in coarse grained region boundary of coarse grained region Comprehensive Analysis Base on microscope analysis and metallographic analysis, the crack locates in coarse grained region of HAZ, cracks along grain boundary while forming from coarse grained region and ending at fine grained region, and there are lots of dispersive small cracks and intergranular cavities.