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Yang, X.H.
Yang, S.X.

[7] Qiming Yang, Xinpin Yang, Shizhong He.

In Chinese [11] Kuifeng Reng, Jingkui Yang, Chengxun Wang: J.
In Chinese [12] Guoqing Xiao, Xinghua Yang: J.

[4] Guomign Xia, Bo Yang, Shourong Wang, New digital drive phase control for improving bias stability of silicon MEMS gyroscope, J.
[10] WANG CH, HUO ZH J, YANG T D, Design of radar pulse generator based on CPLD, J.

References [1] Cheng S, Huang C-M, Pecht M 2017 Microelectronics Reliability 75 77 [2] Nogita K, Greaves M C, Guymer B D, Walsh B B, Kennedy J M, Duke M D, Nishimura T 2010 Transactions of The Japan Institute of Electronics Packaging 3 104 [3] Lin Y-W, Lin K-L 2013 Intermetallics 32 6 [4] Moon K-W, Boettinger W J, Kattner U R, Biancaniello F S, Handwerker C 2000 Journal of electronic materials 29 1122 [5] Yokoi M, Kobayashi T, Shohji I Materials Science Forum p2081-2086 [6] Schwartz M 2014 Soldering: Understanding the basics (ASM International) [7] Lai Y-S, Song J-M, Chang H-C, Chiu Y-T 2008 Journal of Electronic Materials 37 201 [8] Hidaka N, Watanabe H, Yoshiba M 2009 Journal of electronic materials 38 670 [9] Hasnine M, Vahora N 2018 Journal of Materials Science: Materials in Electronics 29 8904 [10] Yang T 2007 Master's thesis, Harbin University of Science and Technology
[11] Azman D I N A, Osman S A, Narayanan P, Kozutsumi Y 2024 Journal of Advanced Research in Micro and Nano Engineering 17 69 [12] Yi J, Zhang Y, Xu L, Liu S, Yang Y 2017 Electronic Components and Materials 31(3) 49-52
20] Izwan Ramli M I, Saud N, Mohd Salleh M A A, Derman M N, Said R M, Nasir N Materials Science Forum p161-166 [21] Johansson J, Belov I, Johnson E, Dudek R, Leisner P 2014 Microelectronics Reliability 54 2523 [22] George.E., Das.D., Osterman.M., Pecht.M. 2011 Transcations on Device and Materials Reliability 11 328 [23] Kanlayasiri K, Kongchayasukawat R 2018 Transactions of Nonferrous Metals Society of China 28 1166 [24] Ma H, Suhling J C J J o m s 2009 44 1141 [25] Abtew M, Selvaduray G 2000 Materials Science and Engineering: R: Reports 27 95 [26] Bai N, Chen X, Fang Z 2008 Journal of electronic materials 37 1012 [27] Xu Y, Gu T, Xian J, Giuliani F, Britton T B, Gourlay C M, Dunne F P 2022 Materials Science and Engineering: A 855 143876 [28] Shohji I, Yoshida T, Takahashi T, Hioki S 2004 Materials Science and Engineering: A 366 50 [29] El-Taher A, Abd Elmoniem H, Mosaad S 2023 Journal of Materials Science: Materials in Electronics 34 590 [30] Zhu F, Zhang H, Guan R, Liu S, Yang

(in Chinese) [5] FANG Yang，A.
(in Chinese) [7] YANG Mingchuan，WANG Chunxiu．Evaluation ModeI on NC Machine Based on Correlation Cofficient Method．Design and Research，2010，2010(1).

Yang and Shihe Yang: J.

Yang, G.Y.
Yang: Improved particle swarm optimization method and its application in the siting and sizing of distributed generation planning.

[3] Zhengwei Ge, Chun Yang, Gongyue Tang, Concentration enhancement of sample solutes in a sudden expansion microchannel with Joule heating, International Journal of Heat and Mass Transfer 53 (2010) 2722–2731
[4] Gongyue Tang, Deguang Yan, Chun Yang, Haiqing Gong, Cheekiong Chai, Yeecheong Lam, Joule heating and its effects on electrokinetic transport of solutes in rectangular microchannels, Sensors and Actuators A 139 (2007) 221–232

Study on Deep Hole Honing Based on Squeeze Film Technology YU Tianbiao 1, WEN Rui 2, GONG Yadong, WANG Wanshan 1 1Sch. of Mechanical Engineering & Automation, Northeastern Univ, Shen yang, 110004, China 2Zhejiang Business and Industry Vocational college, Changzhou, 315012, China tbyu@me.neu.edu.cn Keywords: Squeeze film damper, Surface finishing, Honing, Damping coefficient Abstract.
Yang, Y.