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Study on the buffer layer of CIS thin film solar cell by Separate-melting Chemical Bath Deposition methods King-Leung Wong a, Hung-en Chenb and Wen-Lih Chenc Department of Mechanical Engineering, Kun-Shan University of Technology, 949 Da-Wan Road, Yung-Kung District, Tainan City, Taiwan 710-03 aklwong@mail.ksu.edu.tw, b2954883@yahoo.com.tw, c wlchen@mail.ksu.edu.tw Keywords: Separate-melting Chemical Bath Deposition, cadmium sulphide, buffer layer, CIS thin film solar cell, band gap.
Appl.16, (2008), pp.235–239

Enabling Low Temperature Copper Bonding With an Organic Monolayer Ang Xiao Fang1, a, Wei Jun 1, b, Chen Zhong2, c and Wong Chee Cheong2, d 1 Singapore Institute of Manufacturing Technology, 70 Nanyang Drive, Singapore 38075 2 School of Materials Science and Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798 a xfang@SIMTech.a-star.edu.sg, bjwei@SIMTech.a-star.edu.sg, c ASZChen@ntu.edu.sg, d wongcc@ntu.edu.sg Keywords: Organic monolayer, copper, thermocompression bonding.
Yea-Yang Su," Surface and Interface Analysis, Vol. 40, (2008), 1183-1189

., Wong, Y., Teng, J., Dong, S., and Lam, E.
G., Yu, T., Wong, Y.
[17] Wong, Y.
Composites part B: Engineering, 38 (2008) 451-466

Basavarajappa et al. (2008) studied in detail the formation of burr while drilling MMC.
Wong et al. (2008) [37] studied the effect of drill geometry and drilling methods on tool wear and tool life on titanium alloy (Ti-6Al-4V).
Basavarajappa et al. (2008) studied SiC and graphite reinforcement composite machining.
Wong, S.
Int J Mach Tools Manuf. 2008;48(15):1613–25

Heat Transfer of a Double Layer Microchannel Heat sink Wong Kok Cheonga and Fashli Nazhirin bin Ahmad Muezzinb University of Nottingham Malaysia Campus, Jalan Broga, Semenyih, Selangor, Malaysia a wongkc6@gmail.com, b kedy9fna@nottingham.edu.my Keywords: Microchannel, heat transfer, double layer heat sink Abstract.
International Communications in Heat and Mass Transfer, 35, 2008, 577-582

Materials & Design, 2008. 29(2): p. 297-304
Acta Materialia, 2008. 56(17): p. 4858-4868
Materials Letters, 2008. 62(21-22): p. 3623-3625
Microscopy and Microanalysis, 2008. 14(3): p. 260-266
Scripta Materialia, 2008. 59(7): p. 768-771

Wong, W.
Yoon et al: Colloids and Surface A Vol. 313-314 (2008), p. 448 [5] X.

Wong and T.T.
Vol. 3 (2008), p. 517

Wong: Comput.
Vol. 110 (2008), p.260 [6] J.

Wong, N.Y.
Vol. 194 (2008), p. 333 [12] K.