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Electroless plating technology is one of the advanced technologies in materials science and engineering.
Celik, Journal of Applied Polymer Science Vol 106 (2007), p. 514
Kan, Journal of Applied Polymer Science Vol 96 (2005), p. 919
Huang, Journal of Materials Science Vol 42 (2007), p. 8025
Kan, Journal of Applied Polymer Science Vol 100 (2006), p. 4383.

Experimental Materials.
Lee, Journal of Magnetism and Magnetic Materials, Vol. 311 (2007), p. 36 [6] L.
Santos, and et al, Materials Letters, Vol.60(2006), p270 [7] Yonit Boguslavsky, Shlomo Margel, Journal of Colloid and Interface Science, Vol.317( 2008), p101 [8] Melany Omer-Mizrahi, Shlomo Margel, Journal of Colloid and Interface Science: Vol.329( 2009), p228 [9] X.
Huang, and et al., Journal of Magnetism and Magnetic Materials, Vol.321(2009), p2966 [10] N.Yanase，H.Noguchi，H.Asalcura，and et al.
，Journal of AppIied Polymer Science,Vol.50(1993), p765 [11] G.Xie，Q.Zhang，M.Wu，and et al. , Journal of Applied Polymer Science，Vol.87(2003), p1733

PTFE membrane is a new membrane material, has become one of indispensable material in the cutting edge of science and modern industry.
Journal of Materials Science, 39 , 5613 (2004), pp.784-787
Journal Materials Science, 11, 209(1976),pp.67-68
Journal of Baoji College of Arts and Science (Natural Science), 21, 128(2001),pp.132
Polymeric Material Science & Engineering, 21, 260(2005),pp.260-263

Chen, Materials Science Forum, Vol. 505-507 (2006) pp. 1003-1008
Chen, Journal of Advanced Materials Research, Vols. 591-593 (2012), pp. 2165-2168
Tang, Journal of Applied Mechanics and Materials, Vol. 232 (2012), pp. 955-960
Tang, Journal of Applied Mechanics and Materials, Vol. 319 (2013), pp. 610-615
Chen, Journal of Advanced Materials Research, Vols. 317-319 (2011) 2226-2229

To begin with, statistics of research journals about learning community of recent three years was made.
All of the teachers are supposed to learn in a group or a community; they are willing to help with each other by sharing teaching materials and resources online.
Table1, Statistics about the Journals of Learning Community Based on CNKI from 2011 to 2013.
It is high time to establish resources database, not only including course materials and knowledge database, but also teachers’ self-made resources, such as PPT, teaching plan, sound materials uploaded to be shared with in the community.
Acknowledgements This work is financially supported by the Science and Research Department of my work unit.

Methodology Materials Preparation.
However, it can be improved by adding smaller sizes of filtration materials.
ARPN Journal of Engineering and Applied Sciences, 11(11)
Case Studies in Construction Materials, 16, e01061
Journal of Environmental Science and Technology, 9(1), 100-110.

Study on the amount of SiO2 on the thermal resistance of the ceramic-lined composite cast iron pipe Heguo Zhua, Huan Wangb, Jinzhu Songc, Yinqun Yaod, Jianliang Lie, Yalin Jiangf College of Materials Science & Engineering, Nanjing University of Science & Technology.
Mamyan: Metallurgical Materials and Transaction A Vol. 34(2003)P. 1979 [3] H.X.
Wang: Journal Materials Research Vol.15(2000)P.1943 [4] Z.C.
Fan: Journal of Materials Science Vol.30(1995)P.2554 [9] W.
Lai: Journal of Materials Science Vol.35(2000)P.45

Journal of Materials Science Vol. 35, (2000), p. 1181
Fu: Journal of Materials Engineering and Performance Vol. 15(3) (2007), p. 365
Schuster: Journal of Materials Science Vol. 32(10) (1997), p. 2715
Taniguchi: Diamond and Related Materials Vol. 8(8-9) (1999), p. 1522
Ravichandran: Journal of Materials Science Vol. 33(7) (1998), p. 1933

Xue, L.Zheng and L.Guo: submitted to Journal of Materials Science: Materials in Electronics (2011)
Shi: submitted to Journal of Material Science: Material Electronic (2010)
Ahmad:Materials Science & Engineering A 556 (2012), p. 633-637
Gupta: submitted to Journal of Electronic Materials (2008)
Gupta: submitted to Journal of Material Science: Material Electronics (2009)

The Comparison Between Four PLCC Packages and Eight PLCC Packages in Personal Computer (PC) Using Computational Fluid Dynamic (CFD), FLUENT SoftwareTM Using Epoxy Moulding Compound Material (EMC) M.
Mohd Sukhairi4 1Faculty of Mechanical Engineering, UiTM Pulau Pinang, 13500 Permatang Pauh, Pulau Pinang, Malaysia 2Faculty of Mechanical Engineering, UiTM Shah Alam, 40000 Shah Alam, Selangor, Malaysia 3Center of Excellence Geopolymer & Green Technology (CEGeoGTech), School of Materials Engineering, University Malaysia Perlis 4Faculty of Earth Science, Universiti Malaysia Kelantan a mazlan547@ppinang.uitm.edu.my (corresponding author) Keyword: Plastic Leaded Chip Carrier (PLCC), package chip powers, Computational Fluid Dynamic (CFD), Epoxy Moulding Compound (EMC) Abstract.
Discrete Thermal Sources Flush-Mounted on the Wall, Transactions of the ASME, journal of electronic packaging, Vol. 120, pp 510-514, 1998
Wang, Experiment Study on the Forced Convective Flow in a Channel With heated Blocks in Tandem, Experimental Thermal and Fluid Science, Vol. 16, pp 286-298, 1998
Kim, Forced Convective in Microstructures for Electronic equipment Cooling, ASME Journal of Heat Transfer, Vol.121, pp 639-645, August 1999