Residual Stress Measurement of Industrial Polymers by X-Ray Diffraction

Doi Taisei; Masayuki Nishida; Ozaki Junichi

doi:10.4028/www.scientific.net/AMR.1110.100

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1110Residual Stress Measurement of Industrial Polymers...

Residual Stress Measurement of Industrial Polymers by X-Ray Diffraction

Abstract:

In this study, residual stresses in polyamide (PA) materials were measured by the x-ray stress measurement technique. X-ray stress measurement is widely used to measure residual stresses, however, this measurement is not many used in polymeric materials. There are two problems for measuring residual stresses in polymer. Firstly, the diffraction peak from the polymer appears at the low 2θ angle region. Thus the measurement accuracy for strains reduces. Secondly, the low 2θ angle region is very difficult to use the sin2ψ method. In this study, Ω-diffractometer with transmission method was used to resolve these problems. The measured data was plotted in the d-sin2ψ diagram, and it was coincident with the linear regression line clearly. X-ray elastic constant (XEC) of PA was estimated from these results.

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Periodical:

Advanced Materials Research (Volume 1110)

Pages:

100-103

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1110.100

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Online since:

June 2015

Authors:

Doi Taisei*, Masayuki Nishida, Ozaki Junichi

Keywords:

Polyamide, Residual Stress Measurement, Transmission Diffraction Method, X-Ray

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