Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters

H.P. Yuan; Hang Gao; Yong Jie Bao; Yong Bo Wu

doi:10.4028/www.scientific.net/KEM.389-390.24

Paper Titles

Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone
p.1

Study on the Subsurface Damage of Single Crystal MgO Substrates
p.7

Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer
p.13

Comparative Study on the Materials Removal Mechanism of Ceramics and Steels
p.18

Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters
p.24

Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool
p.30

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
p.36

Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding
p.42

Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model
p.48

HomeKey Engineering MaterialsKey Engineering Materials Vols. 389-390Grinding of Carbon/Epoxy Composites Using...

Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters

Abstract:

Aiming at solving the problems of wheel loading in dry grinding of Carbon/Epoxy composite materials, a novel electroplated grinding wheel with controlled abrasive cluster was developed, in which the diameter of clusters is in Φ0.2 mm to Φ1.0 mm and the interspace between them is about 0.5 mm to 1.0 mm. A conventional electroplated grinding wheel with abrasive grains distributed randomly was fabricated in the same way. The comparison experiments involving C/E composite were conducted on a vertical spindle grinder with the novel and conventional grinding wheels. The results show that the grinding forces of novel wheel developed is more lower though little larger surface roughness, and the wheel loading phenomenon is markedly decreased compared with conventional electroplated wheel.

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Periodical:

Key Engineering Materials (Volumes 389-390)

Pages:

24-29

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.389-390.24

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Online since:

September 2008

Authors:

H.P. Yuan, Hang Gao, Yong Jie Bao, Yong Bo Wu

Keywords:

Abrasive Cluster, C/E Composite, Electroplated CBN Wheel, Grinding

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