Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB

Hiroshi Nojiri; Toshiki Hirogaki; Eiichhi Aoyama; Keiji Ogawa; Tsuyoshi Otsuka

doi:10.4028/www.scientific.net/KEM.389-390.55

Paper Titles

Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool
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Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
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Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding
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Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model
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Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB
p.55

Experimental Trial of Fullerene Wheel Fabrication
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Research of Ultrahigh Speed Grinding Spindle System Based on Squeeze Film Damping Technology
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Development of CNT-Coated Diamond Grains Using Self-Assembly Techniques for Improving Electroplated Diamond Tools
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Proposal of Pulverization Method Based on Grinding Process in Order to Recycle FRP Waste
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Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB

Abstract:

Recently, a new drilling technology has been attracting attention using a super-high-speed spindle and micro diameter drills (less than 0.2 mm). In these drilling conditions, B-RING damage extends more than internal damage around the drilled holes. Therefore, we investigated the best drilling conditions for control of the B-RING, considering productivity. The following conclusions were obtained. (1) The temperature of the drilling tool is raised by decreasing the heat capacity of the drill. B-RING damage around the drilled hole is especially generated under drilling conditions using the super-high-speed spindle and micro diameter drill. (2) B-RING is mainly caused by the heat being conducted to the hole wall of the PWB. (3) Raising the R point height is an effective method for preventing B-RING damage. (4) We confirm obtaining the best drilling condition by considering B-RING and productivity.