Experimental Trial of Fullerene Wheel Fabrication

Takeshi Tanaka

doi:10.4028/www.scientific.net/KEM.389-390.61

Paper Titles

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
p.36

Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding
p.42

Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model
p.48

Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB
p.55

Experimental Trial of Fullerene Wheel Fabrication
p.61

Research of Ultrahigh Speed Grinding Spindle System Based on Squeeze Film Damping Technology
p.67

Development of CNT-Coated Diamond Grains Using Self-Assembly Techniques for Improving Electroplated Diamond Tools
p.72

Proposal of Pulverization Method Based on Grinding Process in Order to Recycle FRP Waste
p.77

Error Analysis and Robust Position Measurement for Vertex of a Small Polyhedron
p.83

HomeKey Engineering MaterialsKey Engineering Materials Vols. 389-390Experimental Trial of Fullerene Wheel Fabrication

Experimental Trial of Fullerene Wheel Fabrication

Abstract:

The purpose of this study is to fabricate a wheel using fullerenes with nano-scaled particles, and to investigate the polishing performance of fullerene wheel. A super smooth surface was formed on a silicon wafer by polishing the wafer with metal-bonded diamond wheels using a diamond abrasive grit of 0-0.125 μm and fullerenes with a diameter of 0.7 nm. We used two kinds of metal-bonded diamond wheels for pre-polishing and a metal-bonded fullerene wheel for the finishing process. Though the surface roughness after polishing with the fullerene wheel was almost equal to that obtained by polishing with the metal-bonded diamond wheel using diamond abrasive grit of 0-0.125 μm, the chemical-mechanical polishing process was clarified by AFM (atomic force microscope) observation when we used a metal-bonded fullerene wheel with 5wt% KOH (potassium hydroxide) solution. The greater number of smoothed portions on the surface of the silicon wafer indicated that the fullerenes provided the same polishing ability as that of the abrasive grit.