Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)

Seong Hyuk Lee; Jung Hee Lee; Jin Woon Lee; Jong Min Kim

doi:10.4028/www.scientific.net/MSF.580-582.213

Paper Titles

Characterization of Contact Formation Process for High Efficiency Solar Cell Using Design of Experiment (DOE)
p.197

Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires
p.201

High Dissolution Rate of Solid Materials in Molten Lead-Free Solders
p.205

Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation
p.209

Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)
p.213

An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
p.217

Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
p.221

Small-Scale Resistance Welding of Crossed TiNi Fine Wire
p.225

Characteristic of Electrochemical Migration on Flexible Printed Circuit Board
p.229

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Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)

Abstract:

A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting- point alloy (LMPA) have been developed. A numerical method for numerical analysis of fusible particles behavior is proposed to investigate coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtain reliable conduction paths, the present study examines the influence of process-related parameters such as volume fraction and viscosity on coalescence characteristics of fusible particles.