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Effects of Conditioning Parameters on Pad Performances

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Abstract:

This paper studied the effects of the off-process conditioning parameters on the pad performances. The pad conditioning was evaluated based on the measurement of pad removal rate, the observation of the conditioned pad surface. The performances of conditioned pads were evaluated also by the material removal rate (MRR) and the surface roughness of polished wafers in the CMP experiments of LiTaO3 crystal wafers.

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Periodical:

Key Engineering Materials (Volumes 375-376)

Pages:

293-297

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.375-376.293

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Online since:

March 2008

Authors:

Xin Wei, Hui Yuan, Wei Xiong, Xiao Zhu Xie

Keywords:

Chemical Mechanical Polishing (CMP), Lithium Tantalite Crystal, Pad Conditioning, Polyurethane (PU)

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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