New Diode Designs Compatible with Vertical 4H-SiC JFET Fabrication Process

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Abstract:

In this paper, we propose new designs of Schottky, JBS and PiN diodes, which process technology is compatible with that of vertical power SiC JFETs. Three novel diode designs are proposed and we report their electrical characteristics. The P+ buried layer implant of the JFET is used for the PiN anode formation and for the P+ islands of the JBS. The Schottky diode differs from a standard Schottky diode since buried rings below the Schottky contact region have been included and the anode metal layer also contacts the buried P+ region at the diode periphery. With this last approach, the resulting Schottky diodes show low leakage currents and surge current capability, with a lower on-state voltage than the JBS.

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Periodical:

Materials Science Forum (Volumes 556-557)

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1003-1006

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September 2007

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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[1] Data sheets available online at: http: /www. infineon. com.

Google Scholar

[2] Data sheets available online at: http: /www. cree. com.

Google Scholar

[3] J. Baliga, Modern Power Devices, Malabar: Krieger, 1992, 476 p., ISBN 0-89464-799-7.

Google Scholar

[4] P. Brosselard, J.L. Galvez, D. Tournier, X. Jordá, P. Godignon and J. Millan, 8th International Seminar on Power Semiconductors (ISPS06), Czech Republic, 29 August - 1 september (2006).

Google Scholar

[5] A. Mihaila, F. Udrea, P. Godignon, T. Trajkovic, G. Brezeanu, J. Rebollo, J. Millan, G. Amaratunga, Material Science Forum, vol. 433-436, pp.891-894, (2003).

DOI: 10.4028/www.scientific.net/msf.433-436.891

Google Scholar