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Sonoelectroplating of Sn - Bi Solder Film from EDTA Bath

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Abstract:

This study concerns the development of Pb free solder plating due to environmental concerns. The composition of the bath was 0.1 mol/dm3 SnY and 0.1 mol/dm3 BiY- in 2 mol/dm3 CH3COOH - 2 mol/dm3 CH3COONa buffer solution (pH 4.0). The bath used 100 cm3 of solution. Plating was carried out at a current density of 50 mA/cm2 using ultrasonic agitation (sonication) at 28 kHz (100 W). Various percentages of a Sn - Bi alloy could be plated. A 41wt.%Sn - 59 wt.%Bi alloy with a melting point of 415 K was obtained from a [BiY-]/[BiY-+SnY] = 0.3 bath. The surface morphologies of the plated films showed a striking difference in accordance with a change of composition.

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Periodical:

Advanced Materials Research (Volumes 29-30)

Pages:

99-102

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.29-30.99

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Online since:

November 2007

Authors:

Atsushi Chiba, T. Kojima, Wen Chang Wu

Keywords:

EDTA Bath, Electroplating, Sn-Bi Solder, Ultrasonic Agitation

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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References

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