Paper Titles
Future Trends in High Intensity Neutron Powder Diffraction
p.181
Texture Inheritance in a Zn Protective Layer
p.189
Effect of Annealing on Structural Properties of Co Thin Films and Co/Cu Multilayers
p.193
Structure and Phase Composition Study of Thin CdS and CdxZn1-xS Films
p.197
X-Ray Diffraction Investigation of Electrochemically Deposited Copper
p.201
Effect of Short-Term Annealing on the Crystalline Structure of Metallic Multilayers with a TiB2 Anti-Diffusion Layer on GaAs Substrate
p.205
Phase Transformations in Metallic Glasses
p.211
Non-Crystallographic Nanopores in Single Crystals: A New Approach in Nanomaterials Chemistry
p.217
Self-Organization in Semifluorinated Polymers
p.223

X-Ray Diffraction Investigation of Electrochemically Deposited Copper

Article Preview

Abstract:

Copper layers were deposited from acidic electrolytes containing different amounts of organic additives, designed for the formation of Cu-interconnect structures. Amorphous Ni-P substrates allow to study the unbiased growth of the electrodeposits. The crystallographic texture was investigated by the determination of X-ray diffraction (XRD) pole figures and the calculation of the orientation distribution functions. XRD results are discussed in relation to the morphologies of the electrodeposits as investigated with light optical microscopy and correlated with the process parameters during electrodeposition.

You might also be interested in these eBooks
European Powder Diffraction EPDIC 8 View Preview

Info:

Periodical:

Materials Science Forum (Volumes 443-444)

Pages:

201-204

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.443-444.201

Citation:

Cite this paper

Online since:

January 2004

Authors:

Karen Pantleon, Jens Dahl Jensen, Marcel A.J. Somers

Keywords:

Copper (Cu), Electro-Deposition, Texture, Thin Film, X-Ray Diffraction (XRD)

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2004 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanichevsky, R. D. Kelly, G. R. Stafford and D. Josell: J. Electrochem. Soc. 147 (2000), p.4524.

DOI: 10.1149/1.1394096

Google Scholar

[2] I. Handreg, P. Klimanek, G. Lange and E. Weiland: Proc. of the 4th Europ. Conf. on Advanced Materials and Processes, Vol. 2 (1995), p.471.

Google Scholar

[3] C. Lingk, M. E. Gross and W. L. Brown: J. Appl. Phys. 87 (2000), p.2232.

Google Scholar

[4] H. -J. Bunge, Texture Analysis in Materials Science: Mathematical Methods (Cuvillier Verlag, Göttingen 1993).

Google Scholar

[5] K. Fischer (now Pantleon) and H. Oettel: Mater. Sci. Forum Vol. 273-275 (1998), p.567.

Google Scholar

[6] I. Handreg and P. Klimanek: Mater. Sci. Forum Vol. 157-162 (1994), p.1405.

Google Scholar

[7] J. D. Jensen, K. Pantleon, M. A. J. Somers and L. Hultman, in preparation.

Google Scholar

[8] Q. -T. Jiang, R. Mikkola, R. Ortega and V. Blaschke: Mat. Res. Soc. Symp. Proc. 564 (1999), p.393.

Google Scholar