Measurement Technology and Intelligent Instruments VI
Key Engineering Materials Volumes 295 - 296
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p3
Laser Scattering Measurement of Microdefects on Silicon Oxide Wafer
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338 K
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Authors: Taeho Ha, Takashi Miyoshi, Yasuhiro Takaya, S. Takahashi -
p9
Characterisation of Surface Properties by a Multi-Function TPM
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564 K
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Authors: X.P. Liu, J. Zhang -
p15
Development of an Evanescent Light Measurement System for Si Wafer Microdefect Detection
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2 M
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Authors: S. Takahashi, R. Nakajima, Takashi Miyoshi, Yasuhiro Takaya, Kiyoshi Takamasu -
p21
An Embedded FBG Sensor for Dynamic Strain Measurement for a Clamped-Clamped Composite Structure
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1 M
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Authors: Hang Yin Ling, Alan Kin Tak Lau, Li Cheng, J. Wei, R.S. Thomson, M.L. Scott -
p27
A Thermovision Method for Studying Deformation Kinetics of Materials and Structure Elements
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440 K
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Authors: Evgeny S. Lukin, Alexandr M. Ivanov -
p33
Damage Detection of Composite Structures Using Dynamic Analysis
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99 K
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Authors: L.H. Yam, Li Cheng, Z. Wei, Y.J. Yan -
p39
Investigation of Nonisothermal Crystallization Behaviors of Poly and Silica Nanocomposites Using Differential Scanning Calorimetry
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145 K
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Authors: Ling Xue Kong, Z. Peng -
p45
Ellipsometric Detection of Transitional Surface Structures on Decapped GaAs(001)
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6 M
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Authors: A.V. Vasev, S.I. Chikichev -
p51
Temperature Effect on the Stability of CuO Nanofluids Based on Measured Particle Distribution
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677 K
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Authors: Ho Chang, Chih Hung Lo, Tsing Tshih Tsung, Y.Y. Cho, D.C. Tien, Liang Chia Chen, C.H. Thai -
p57
Determination of Young's Modulus of Micromechanical Silicon Films Using an Acoustic Excitation and Optical Detection Resonance Method
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119 K
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Authors: Y.M. Liu, W.J. Tian, S.J. Zhang
