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Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength

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Abstract:

The effects of void formation on the joint strength and failure mode of the solder joints were examined. A computational modeling technique, i.e., finite element modeling, was employed to investigate the effects. The effects of location, size and number of void were also investigated and compared with the case that has no void in the solder ball. When there was 1 or more voids in the solder ball, the joint strength decreased regardless of the location, size, and number of voids. Especially, the shear force of the joints decreased about 50% when 3 voids were formed in the solder ball. From the stress analyses, the possibility of preliminary brittle interfacial failure should be lower when voids were formed in the solder ball.

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Info:

Periodical:

Materials Science Forum (Volumes 510-511)

Pages:

546-549

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.510-511.546

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Online since:

March 2006

Authors:

Jong Woong Kim, Seung Boo Jung

Keywords:

BGA, Finite Element Analysis (FEA), Pb-Free Solder, Shear Test, Void

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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References

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