Paper Titles
Single Backside Cleaning on Silicon, Silicon Nitride and Silicon Oxide
p.249
The Degradation Prevention of Resin Materials for Semiconductor Manufacturing Equipment by Applying the Ultra-High Purity Gas Supply Technology
p.255
Measurement and Control of Airborne Molecular Contamination during Wafer Storage and Transport
p.259
Purification of Trace Amount of Metal Impurity from Ultra Pure Water Using Membrane Purifier/Filter
p.265
Metal Contamination on Silicon Surfaces from Solvents
p.269
Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP
p.275
A Force Study in Brush Scrubbing
p.279
Dissolution Characteristics of Ceria in Ascorbic Acid Solutions with Implications to Cleaning
p.283
Investigation of Dissolution and Electrodeposition of Copper in Concentrated and Diluted Oxalic Acid Media in Post-CMP Cleaning
p.287

Metal Contamination on Silicon Surfaces from Solvents

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Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

269-274

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.269

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Online since:

April 2005

Authors:

Twan Bearda, Ief Vander Mot, Kristel Van den Broeck, Nausikaä Van Hoornick, Jan Van Hoeymissen, Paul W. Mertens

Keywords:

Ethyl Lactate, IPA, Metal Contamination, PGMEA, Solvent

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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