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Key Engineering Materials Vol. 196

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.196

ToC:

Table of Contents

Paper Title Page

Preface
Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor
Authors: Hong Ho Cheng, H.Y. Tsai, Yue Long Huang
1
A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process
Authors: Junji Watanabe, R. Etoh, M. Hirano
25
Some Essentials of Simulating Nano-Surfacing Processes Using the Molecular Dynamics Method
Authors: Wun Chet Davy Cheong, Liang Chi Zhang, Hiroaki Tanaka
31
Assessment of the Exit Defects in Carbon Fibre-Reinforced Plastic Plates Caused by Drilling
Authors: Hou Jiang Zhang, Wu Yi Chen, Ding Chang Chen, Liang Chi Zhang
43
Grinding of Ceramics: Strength, Surface Features and Grinding Conditions
Authors: Tian Shu Liu, Bruno A. Latella, Liang Chi Zhang
53
Grinding Burn Mechanism of Directionally Solidified Superalloy
Authors: Ming Chen, Fang Hong Sun, Bing Yuan Xue
61
Wear Mechanism of Diamond Cutting Tool in Machining of Steel
Authors: Hiroaki Tanaka, Shoich Shimada, Naoya Ikawa, M. Yoshinaga
69
A Friction Model for Free-Machining Steels and Its Applicability to Machinability Analysis
Authors: K. Maekawa, Akihiko Kubo, T.H.C. Childs
79
Improvement of Friction and Wear Properties of CVD-SiC Films with New Surface Finishing Method 'ELID-Grinding'
Authors: T. Kato, Hitoshi Ohmori, C. Zhang, T. Yamazaki, Y. Akune, K. Hokkirigawa
91

Showing 1 to 10 of 19 Paper Titles