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Theory, Modeling and Numerical Simulation

Solid State Phenomena Volume 139

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• p95 Phase-Transformation Wave Dynamics in LiFePO₄   [ 586 K ]
  Authors: Damian Burch, Gogi Singh, Gerbrand Ceder, Martin Z. Bazant
• p101 Molecular-Dynamics Analysis of the Structural Properties of Silica during Cooling   [ 252 K ]
  Authors: Byoung Min Lee, Shinji Munetoh, Teruaki Motooka, Yeo Wan Yun, Kyu Mann Lee
• p107 Atomistic Simulations of Copper Precipitation and Radiation Induced Segregation in α-Iron   [ 225 K ]
  Authors: Frédéric Soisson, Chu Chun Fu
• p113 Ab-Initio Calculation for the Study of Nano Scale Silicon Based Device Structure   [ 701 K ]
  Authors: Sudip Chakraborty, G. Sashidhar, S.V. Ghaisas, V. Sundararajan
• p119 Modelling of Elastic Modulus and Molecular Structure Interrelationship of an Oriented Crystalline Polymer   [ 132 K ]
  Authors: Ulmas Gafurov
• p123 Reaction Rate as an Effective Tool for Analysis of Chemical Diffusion in Solids   [ 266 K ]
  Authors: Micha Sinder, Z. Burshtein, Joshua Pelleg
• p129 Simulation of the Columnar-to-Equiaxed Transition in Alloy Solidification - The Effect of Nucleation Undercooling, Density of Nuclei in Bulk Liquid and Alloy Solidification Range on the Transition   [ 1 M ]
  Authors: H.J. Dai, H.B. Dong, H.V. Atkinson, Peter D. Lee
• p135 Simulation of Surface-Enhanced Ordering in Smectic Films   [ 731 K ]
  Authors: Nasser Mohieddin Abukhdeir, Alejandro D. Rey
• p141 Atomic Scale Modelling of Materials: A Prerequisite for any Multi-Scale Approach to Structural and Dynamical Properties   [ 869 K ]
  Authors: Masahiko Matsubara, Massimo Celino, Philip S. Salmon, Carlo Massobrio
• p151 Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints   [ 644 K ]
  Authors: Tarik Omer Ogurtani, Oncu Akyildiz
• p157 Effect of C on Vacancy Migration in α-Iron   [ 186 K ]
  Authors: Chu Chun Fu, Estelle Meslin, Alain Barbu, F. Willaime, V. Oison