Papers by Author: Andrey Bakin

Abstract: In this paper a wire-bond technology for high temperatures (up to 500°C) based on silver-wire is presented. The mechanical properties of silver thick-wire wedge bonds are analyzed and compared to previously presented silver-stripes fastened onto the chip with the Low Temperature Joining Technique (LTJT) and to common aluminum thick-wire.

Abstract: In this paper a die-attachment technology for high temperature applications based on the Low Temperature Joining Technique (LTJT) is presented. The present challenge is to fit the thermal expansion as well as the mechanical properties of the die-attach layer to the characteristics of chip and substrate. While the classic LTJT is based on sintering a sub-micron silver paste at temperatures between 150°C and 300°C to bond an electronic device to a substrate, the modified procedure employs a powder mixture consisting of silver powder and special filling powder material. Type and amount of the filling material is dependent on the application and the used substrates. Considering a low thermal expansion and high electrical as well as thermal conductivity we chose SiC, TiC, and BN as filling materials in this work.