Papers by Author: Erich Kasper

Abstract: We analyzed multi quantum well light emitting diodes, consisting of ten alternating GeSn/Ge-layers, were grown by molecular beam epitaxy on Si. The Ge barriers were 10 nm thick and the GeSn wells were grown with 7% Sn and thicknesses between 6 and 12 nm. Despite the high threading dislocation density of 10⁹ to 10¹⁰ cm⁻² the electroluminescence spectra measured at 300 and 80 K yield a broad and intensive luminescence band. Deconvolution revealed three major lines produced by the GeSn wells that can be interpreted in terms of quantum confinement. Biaxial compressive strain causes a splitting of light and heavy holes in the GeSn wells. We interpret the three lines to represent two direct lines, formed by transitions with the light and heavy hole band, respectively, andan indirect line.

Abstract: We present an overview on generation of direct gap photo- and electroluminescence in Ge bulk wafers, Ge thin films deposited on Si, and Ge p-i-n diodes prepared on Si substrates. We analyzed the emission in a spectral range from 0.45 eV to 0.95 eV, covering the radiation caused by direct gap transitions, the indirect one, and also the luminescence related to transition on dislocations. The temperature and excitation level strongly influence the intensities of direct and indirect photoluminescence in bulk samples. As it could be expected, high temperature and excitation favour the generation of direct gap luminescence. Intrinsic bulk Ge shows a quadratic dependence of the direct gap luminescence on the excitation and a sub-quadratic one for the indirect. The photoluminescence spectra taken from intrinsic Ge on Si layers show features related to dislocations. There are two spectral regions associated with dislocation recombination. At room temperature one is at around 0.45 eV and the other at 0.72 eV. We found strong direct gap radiation from the Ge p-i-n diodes with intrinsic, highly dislocated active area (dislocation density of about 10⁸-10¹⁰ cm^-2). There is a threshold current density of 8 kA/cm², at which the direct band luminescence becomes a super-quadratic. The dependence of the radiation intensity on the excitation is governed by a power law with exponent of 1.7 before reaching that threshold and 4.5 after exceeding it. Above the threshold the dislocation radiation shows similar dependence on the excitation as the direct band luminescence.

Abstract: We present a novel Ge on Si based LED with unstrained i-Ge active region. The device operates at room temperature and emits photons with energy of 0.8 eV. It basically resembles a p-i-n structure formed on a sub-micrometer thin Ge layer. The Ge layer has been grown on Si substrate by utilizing thin virtual buffer, so it becomes stress free but with high threading dislocation density. We show that such forward biased diode generates strong emission, caused by direct band to band transition in Ge. Using an InSb based detector we were able to analyze the emission spectrum in a broad energy range. We show that at low and moderate currents, features belonging to the direct and the indirect band to band electronic transitions are present which are characteristic for Ge. Clearly dominating is the direct transition related peak. Due to the missing stress-related red shift this peak appears close to the desired communication wave length of 1.55 μm. The dependence of radiation intensity on the excitation current follows a power low with exponent of 1.7, indicating that the recombination rate of the competitive nonradiative processes is relatively low. At high excitation currents features appear in the low energetic part of the spectrum. All results presented here are discussed in view of the outcome from measurements on Ge high quality bulk material. The role of the dislocation in the Ge films is discussed.

Abstract: Heterostructure device concepts promise several advantages in micro- and optoelectronics. From the material point of view, the main obstacle to be overcome is the large lattice mismatch of silicon based heterostructures. One of the best of them, silicon germanium (SiGe) is lattice mismatched to silicon by up to 4% depending on its Ge content. Basic investigations on strained layer growth, interface properties, and deviation from equilibrium are done with SiGe / Si heterostructures. Early results are discussed in context with our recent understanding. The application focus of this review is devoted to micro- and optoelectronic devices which could be fabricated after solving or understanding the basic interface problems. This includes devices already in production, and those in emerging fields for inclusion in the next generation of integrated circuits, as well as a selection of future device concepts with high merits to be proven in experiment.

Abstract: Requirements and applications for three different scenarios in material science of microelectronics are discussed. Dimension scaling continous at the same pace (More Moore) by changing to immersion lithography and later to extreme ultraviolet lithography. The functionality of system on chip solutions will be increased by heterogeneous technologies combined with a microelectronics core ( More than Moore). Material science and physical understanding of new device principles started well in advance to judge difficulties and options. The strong links to economy are illustrated by a simple model of exponential growth.

Abstract: Microelectronics is a central area within information technology, which is still one of the most important global technologies. It will be shown that the development of integrated circuits is based on a long and fascinating history, which is unique in modern time. Yet, the fantastic growth in semiconductor electronics is due to a unique combination of basic conceptional advances, the perfection of new materials and the development of new device principles. A brief survey of the development of microelectronics is given by not only focusing on the history of microelectronics but also taking into account materials and market aspects. Since microelectronics is an extremely complex area, a few criteria and reference points for integrated circuits are given. Thereafter, some examples are presented indicating the rapidly changing state-of-the-art. It will be shown that the development of material science within the area of microelectronics is not always driven by scientific curiosity but often by arbitrary and not always obvious preferences. After a short discussion of the performance advantages and disadvantages of germanium, silicon and III-V compound semiconductors, the SiGe heterojunction bipolar transistor is taken as an example for demonstrating a few important differences in the performance of all-silicon devices with regard to silicon-based heterojunction devices in general. In conclusion, the impact of human enterprise and research policy on the development of microelectronics is briefly discussed.

Abstract: Strain adjustment is obtained by virtual substrates which are composed of a silicon substrate and a strain relaxed buffer. The basics of strain relaxation are explained and applied to the covalent bonded Si/Ge system which shows a large regime of metastability. A solution to ultrathin strain relaxed buffers is given by the injection of point defects which nucleate to dislocation loops in the interface. Principle and injection mechanism are shown.

Abstract: Molecular beam epitaxy is employed for the growth of strained-Si layers on top of virtual substrates with highly-relaxed ultrathin SiGe buffers in a continuous procedure. An initial growth stage at a temperature-ramp down to below 200°C causes misfit-dislocation generation by nucleation from point defects and provides an early relaxation in the SiGe buffers. In situ monitoring is used for the growth control. Layer thicknesses and composition are proved by ex situ spectroscopic ellipsometry. %Raman investigations on the layer stacks reveal high degrees of relaxation (70-100%) in sub-100nm SiGe buffer layers containing from 12 to 42 % Ge. Stress in strained Si layers estimated by means of Raman-spectra shift is adjustable from 0.92 to 6.84 GPa by the Ge-content in virtual substrates. Surface morphology of strained Si and of relaxed SiGe buffers is smooth and crosshatch-free. Device test structures show substantial increase of carrier mobilities in nMOSFETs fabricated on these strained-Si layers.