Papers by Author: Maher Soueidan

Abstract: h-BN layers were deposited on α-SiC substrates by CVD at high temperature (1500-1900°C) using B2H6 and NH3 diluted in Ar. Growth rates were in the 6-10 µm/h range. In all the conditions studied, the BN as deposited layers were found to be translucent to light, some having a light whitish aspect and other a more yellowish one. It was also observed that the deposit was not always adhesive. µ-Raman and TEM characterization showed that the layers were nano-crystalline with crystallite size < 10 nm. The growth rate was found temperature and N/B ratio dependent due to an N limited growth regime which is more pronounced above 1700°C.

Abstract: Complementary lateral structures, N-JFETs, P-JFETS and bipolar diodes, have been implemented in p and n-type 4H-SiC wafers with epilayers. The device were optimized using finite element code MEDICITM simulations, based on ion implanted and etched Reduced-Surface-Field structures. Two Ti/Ni alloy composition are found to form ohmic contacts compatibles with high temperature device operation. 900°C and respectively 1000°C post-metallisation annealing during 2min are necessary. The presence of a graphite layer is determined by XPS (X-ray photon spectroscopy) analyses at the metal-semiconductor interface. On the fabricated p and n-type lateral JFETs, in blocking state, breakdown voltage as high as 600V are obtained.

Abstract: We report an optical study of 3C-SiC layers grown on 6H-SiC substrates by VLS mechanism using a Si-Ge melt. The photoluminescence and μ-Raman results show a clear and significant incorporation of germanium in the layers from the melt. A photoluminescence emission attributed to Ge related transitions is observed in the infrared region. μ-Raman spectra exhibit two peaks related to the Ge-Ge and Si-Ge bonds. From the characteristics of these Raman peaks, it was found that the amount of Ge incorporated inside the 3C layers increases with increasing Ge content of the melt. This has been verified by Particle-Induced X-rays Emission (PIXE) measurements which gave a Ge concentration varying from ~ 1x1019 to ~ 1x1020 at.cm-3. All these results suggest that Ge incorporates in the VLS grown 3C layers by forming Si-Ge-(C) nanoclusters.

Abstract: Twin-free 3C-SiC layers were recently obtained by Vapour-Liquid-Solid mechanism on a a-SiC(0001) substrate using Si-Ge melt. The formation of cubic layers is rather unexpected since growth from the melt is known to promote lateral growth and should thus give homoepitaxial layers. The study of the early stage of such growth, after a simple contact between the melt and the substrate (without adding propane), reveals the precipitation of 3C-SiC elongated islands upon the substrate surface. The chemical interactions inside the Ge-Si-C ternary phase diagram suggest an initial dissolution of the SiC seed in contact with a Ge-rich melt (below 1200°C). When the Si content of the melt subsequently increases upon heating, the dissolved carbon atoms precipitate on the seed surface under the form of 3C-SiC islands. When propane is added, these islands enlarge and coalesce to form a complete 3C layer.

Abstract: The growth kinetics of 3C-SiC heteroepitaxial layers on α-SiC substrates by Vapour-Liquid-Solid (VLS) mechanism in Ge-Si melts was investigated. Various parameters were studied such as temperature, melt composition, propane flux and substrate nature (polytype, polarity and misorientation). It was found that the growth rate increases with increasing temperature, propane flux, Si content of the melt and misorientation of the substrate. The calculated activation energy (from 4.7 to 6.6 kcal/mole depending on the substrate type) is very small suggesting that the limiting process is the diffusion of the dissolved carbon inside the melt. The carbon solubility inside the melt mainly affects the carbon dissolution kinetics from the gas phase. The results also suggest that surface effects are important through the layer polarity and crystalline quality.

Abstract: We report on the heteroepitaxial growth of 3C-SiC layers by Vapor-Liquid-Solid (VLS) mechanism on Si face 6H-SiC substrates, on-axis and 3.5° off. The Si-Ge melts, which Si content was varied from 10 to 50 at%, were fed by 3 sccm of propane. The growth temperature was varied from 1200 to 1600°C. It was found that 3C-SiC layers (either twinned or twinned free) form at low temperature while homoepitaxy is achieved at high temperature. The proposed growth mechanism involves the initial formation of 3C islands during the heating ramp (below 1200°C) and the dissolution of these islands when temperature increases. Geometrical aspects, such as the step density at the surface and the vertical component of the growth, are also considered to explain the difference observed between the on and off axis substrates.

Abstract: The aim of the present work is to study the structural properties of 3C-SiC which is grown on (0001) 6H-SiC and on (100) 3C-SiC (Hoya) seeds using the Continuous Feed Physical Vapor Transport (CF-PVT) method. Transmission Electron Microscopy (TEM) observations confirm that the overgrown layer is of the 3C-SiC polytype. In the case of the 6H-SiC substrate, microtwins (MTs), stacking faults (SFs) and dislocations (D) are observed at the substrate-overgrown interface with most of the dislocations annihilating within the first few µm from the interface. In the case of 3C-SiC crystals grown on 3C seeds, repeated SFs are formed locally and also coherent (111) twins of 3C-SiC are frequently observed near the surface. The SF density is reduced at the uppermost part of the grown material.

Abstract: This paper studies the electronic properties of MOS capacitors fabricated on double positioning boundary free 3C-SiC/6H-SiC where the 3C-SiC films were grown using the Vapour- Liquid-Solid mechanism. The temperature- and frequency-dependent electrical properties of SiO2/3C-SiC/6H-SiC structures have been studied. Capacitance measurements indicate that the single-domain 3C-SiC film is doped near the surface with an average concentration of 8.3 × 1016 cm-3. The measured interface state density near the conduction band edge of 3C-SiC is below 1011cm-2⋅eV-1 and increases towards mid-gap as obtained from conductance and capacitance measurements. Our results are consistent with the assumption that the interfaces of SiO2/ n-type SiC consist of two different kinds of interface traps – the carbon clusters located at the interface and the intrinsic defects located within the oxide layer.

Abstract: We report the results of a SIMS and micro-Raman investigation performed on cubic (3C) SiC crystals grown on hexagonal SiC seeds using a Ge-Si bath and the so-called Vapor Liquid Solid growth technique. From SIMS measurements, we find a Ge concentration which, roughly, scales like the Ge concentration in the melt and, in term of micro-Raman measurements, explains the presence of weak but discernable Ge-Ge peaks around 300 cm-1. Since no similar Si-Si vibrations are found, this discard the possibility of having at the same time both Ge and Si constitutional super-cooling with two separate Ge and Si phases.

Abstract: We report an optical investigation of cubic Silicon Carbide (3C-SiC) layers grown on 6H-SiC substrates by Chemical Vapour Deposition and Vapour-Liquid-Solid mechanism. Micro- Infrared reflectance ('-IR), micro-Raman ('-Raman) and low temperature photoluminescence spectroscopies were used for the characterisation of such layers. '-IR measurements showed unusual optical behaviour of 3C-SiC layers. The difference of refraction index between the 3C-SiC film and the 6H-SiC substrate cannot explain this result. The experimental '-IR reflectance spectrum was modelled by introducing a thin (thickness ≤ 0.5 'm) metallic-like (doping ≥ 1020 at.cm-3) interfacial film between the layer and the substrate. The photoluminescence spectra revealed the presence of a peak which may be attributed to recombination at the 3C/6H interface. All these results suggest the presence of a two dimensional electron gas at the interface.