Papers by Author: Nicolas Camara

Abstract: 4H-SiC p-i-n diodes were designed, fabricated and characterized for use in microwave applications. The diodes exhibited a blocking voltage of 1100 V, a 100 mA differential resistance of 1-3 &, a capacitance below 0.5 pF at a punchthrough voltage of 100 V and a carrier effective lifetime between 15-27 ns. Single 4H-SiC p-i-n diode switches, operating in X-band, exhibited insertion loss 0.7 dB, isolation up to 25 dB and were able to handle microwave power up to 2.2 kW in pulsed mode of operation. The switching speed of the switches has not exceeded 20 ns.

Abstract: 4H-SiC p-i-n diodes were fabricated on epitaxial layers grown by Sublimation Epitaxy in Vacuum (SEV) and were evaluated for microwave power switching applications. Full electrical characterization (C-V, DC I-Vs, reverse recovery characteristics, low and high power microwave testing) has been performed. The results showed that SEV-grown SiC material is suitable for bipolar device fabrication. A doping higher than 1019 cm-3 for the p-type contact layer and lower than 1016 cm-3 for the n-type base layer is necessary to demonstrate microwave p-i-n diodes with similar performance as the ones fabricated on commercially available CVD-grown material.

Abstract: The packaged microwave 4H SiC pin diode chips (with i-region length of 6 μm, mesa diameter of 80 μm and blocking voltage of 1000 V) were investigated. We studied the parameters of diode I−V curve (in particular, the diode resistance RS at forward current) and the processes of diode switching from forward current of 50 mA to reverse voltage of 15 V, as well as C−V curves, in the 20−700 °C temperature range. At a voltage of 300 V, the diode reverse current was 10 (180) μA when temperature was 600 (700) °C. At a forward current of 40 mA, the diode resistance first decreases smoothly as temperature is increased from 20 up to 300 °C, and then grows up. As temperature is increased from 20 up to 700 °C, the effective lifetime τeff grows from 7 up to 50 ns, while the diode capacitance (in the 0−40 V reverse voltage range) grows smoothly as temperature is increased from 20 up to 400 °C.

Abstract: The results of mathematical simulation, development and investigation of a modulator with 4H SiC pin diodes are presented. We simulated the effect of bias modes on isolation and transmission between the modulator input and output in the 1−20 GHz frequency range, for pin diodes with 6 μm long i-region. It was calculated that the isolation in a modulator with three diodes may run into –45 dB, the transmission losses being no more than 2 dB. The modulator was made as an integrated circuit (IC) on the basis of nonsymmetrical strip lines (characteristic impedance of 50 Ω) incorporating chips of high-voltage 4H SiC pin diodes with iregion 6 μm long, mesa diameter of 60 μm and calculated avalanche breakdown voltage of 1000 V. We studied the experimental parameters of this modulator as a function of forward current and reverse voltage in the 2.4−12 GHz frequency range, as well as the microwave signal switching behavior. It was determined that the modulator is characterized by transmission losses of 1.0−2.0 dB and isolation of 27−34 dB (in the 2.4−7 GHz frequency range). The formation of microwave pulses with leading (trailing) edge of 22 (29) ns was also observed.

Abstract: 4H-SiC pin diodes were fabricated on epitaxial layers grown by Sandwich Sublimation Method (SSM). I-V and photoemission measurements were conducted on these devices. These measurements show hot spots responsible for a soft breakdown and evidence triangular shape defects previously observed in 4H-SiC pin diodes made on CVD epitaxial layers. These results agree with the morphology studies which indicate that the SSM-grown layers have a higher number of structural defects than their counterparts.

Abstract: The switching characteristics of 4Н-SiС p-i-n diodes with 6 µm long i-region were investigated in the 20÷500 °С temperature ranges. It is shown that the diode reverse current increases with temperature and does not exceed 10-7 А at temperature of 500 °С (UR = 100 V). The diode resistance rF at forward current of 40 mA decreases as temperature increases from 20 up to 500 °С. The effective minority charge carrier lifetime in the i-region (τр) was determined from the diode switching (from forward current to reverse voltage) characteristics; it was about 5 ns. As temperature increases from 20 up to 500 °С, τр increases by a factor of 3. We discuss the possibility of application of such diodes (i) in microwave switching facilities and (ii) as temperature sensors. A comparison is made between the parameters of 4Н-SiС p-i-n diodes and those of Si p-i-n diodes with comparable values of calculated blocking voltage.

Abstract: The defects were investigated in p+nn+ 4H-SiC diodes by observing the forward-biasinduced light emission through the substrate. The spatial intensity distribution, the temporal evolution and the spectral content of the electroluminescence (EL) signal have been measured in order to detect, identify and understand the defect formation during forward-bias application. It was found that, exept from the dislocations inside the epilayers, mesa etching is a main cause for the formation of extended defects. To our knowledge, for the first time, reduction of mesa-etchinginduced defects is shown in this investigation.

Abstract: Structural defects in SiC crystals were investigated and 4H-SiC pin devices were characterized by micro-Raman scattering and photoemission. With the experimental set-up presented, defects could be successfully detected in SiC crystals but stacking faults could not be detected with micro-Raman scattering, although they could be detected by photoemission. Residual stress could be evaluated in 4H-SiC devices, as well as the temperature increase associated with the devices powering. A good correlation was found between the characterization techniques used: micro-Raman scattering and photoemission.