Papers by Author: Pierre M. Masri

Abstract: Germanium modified silicon surfaces in combination with two step epitaxial growth technique consisting in conversion of the Si(100) substrate near surface region into 3C-SiC(100) followed by an epitaxial growth step allows the manipulation of the residual strain. The morphology and the residual strain in dependence on the Ge coverage are only affected by the Ge quantity and not by the growth technique. The positive effect of the Ge coverage is attributed to changes in the morphology during the conversion process, as well as to a reduced lattice and thermal mismatch between SiC and Si in consequence of alloying the near surface region of the Si substrate with Ge.

Abstract: In this paper we present a methodology to affect the stability of polytypes formation during heteroepitaxial growth of SiC on Si. This methodology is based on the investigation of growth related parameters. These parameters involve substrate temperature, effect of impurities on surface diffusion, strain, and super-saturation conditions as solved by using SSMBE growth (Solid Source molecular beam epitaxy).

Abstract: Metal impurities are known to degrade dramatically the performances of silicon-based devices, even at concentrations as low as 1012 cm-3. A specific process, named proximity gettering, has been optimised by some authors in order to reduce the influence of these impurities [1]. This process consists in the building of a favourable impurity trapping zone in a non-active area of the device, by introducing implantation defects. This paper reports on the application of introducing such gettering sites as an approach to control phonon properties in 4H-SiC epilayer, and increase the thermal conductivity.

Abstract: We report on the application of introducing gettering sites as an approach to control some phonons and charge carrier related properties in 4H-SiC epilayer. Helium implantation (at room temperature or 750°C) was first carried out, followed by a proper annealing and gold diffusion, in order to check the gettering efficiency. Raman measurements showed the presence of the desired defect, introduced by ion implantation at RT. The shift of the Fano interference allowed us to calculate the free carriers’ density in each sample. The lowest value was found for the sample implanted at RT. The gettering sites can act as majority carrier traps and reducers of recombination processes, which can be interesting for devices designed for the detection of radiations.

Abstract: The influence of the growth conditions on the 3C-SiC layer quality in terms of crystallinity, morphology and residual strain was investigated. In dependence on the chosen growth conditions the stress state can be varied between inhomogeneous and homogeneous strain. For the reduction of the residual strain an alternative route for the improvement of the epitaxial growth of 3CSiC( 100) on Si(100) was developed. It consists in covering the silicon wafers with germanium prior to the carbonization step. The achieved improvement in the residual strain and crystalline quality of the grown 3C-SiC layers is comparable to SOI substrates. These beneficial effects were reached by using a Ge coverage in the range of 0.5 to 1 monolayer with respect to the silicon surface.