Papers by Author: W.E. Carlos

Abstract: Low temperature infrared photoluminescence (PL) performed on a large set of bulk SiC substrates has revealed distinct series of lines between 0.8 and 1.5 eV for samples with nitrogen levels between ~ 1016 and 1017 cm-3. Semi-insulating and intentionally N-doped wafers grown by PVT and HTCVD were investigated. Two groups of PL lines clustered near 1.0 and 1.35 eV, respectively, were observed in n-type 4H-SiC. Not surprisingly, a multiplicity of features at slightly different energy positions was found for this emission from the 6H- and 15R-SiC polytypes. Both sets of lines were not observed for substrates with N doping concentrations greater than 3x1017cm-3. Thus, it appears this IR emission can serve as optical “fingerprints” of bulk n-type substrate with moderate levels of N impurities. Models for the possible origins of these lines will also be discussed.

Abstract: We have recently explored the nature and stability of native defects in high-purity semi-insulating 4H-SiC bulk substrates grown by PVT and HTCVD methods after post-growth anneal treatments up to 2400oC using electron paramagnetic resonance (EPR) and low-temperature photoluminescence (PL) experiments. In the present study we have extended these investigations to SI 4H-SiC subjected to the same post-growth high-temperature anneal treatments, where significantly enhanced carrier lifetimes have been reported for such conditions, but cooled at different rates ranging from ~2-25oC/min. Previously, the intensities of the native defects decreased monotonically with anneals from 1200–1800oC; however, it was recently observed that several of these defects reappear after annealing at 2100oC and above. Our results illustrate the effects of the post-growth anneal treatments and cool-down rates on the concentrations of native defects.

Abstract: Undoped 6H- and 4H-SiC crystals were grown by Halide Chemical Vapor Deposition (HCVD). Concentrations of impurities were measured by various methods including secondary-ion-mass spectrometry (SIMS). With increasing C/Si ratio, nitrogen concentration decreased and boron concentration increased as expected for the site-competition effect. Hall-effect measurements on 6H-SiC crystals showed that with the increase of C/Si ratio from 0.06 to 0.7, the Fermi level was shifted from Ec-0.14 eV (nitrogen donors) to Ev+0.6 eV (B-related deep centers). Crystals grown with C/Si > 0.36 showed high resistivities between 1053 and 1010 4cm at room temperature. The high resistivities are attributed to close values of the nitrogen and boron concentrations and compensation by deep defects present in low densities.

Abstract: We have employed low-temperature photoluminescence to estimate the total residual N concentration in semi-insulating (SI) SiC substrates where all N shallow donors are compensated in the dark. The ratio of the nitrogen-bound exciton line (Qo) to the free excitonic emission (I77) as a function of excitation power density (Pexc) was tracked for several SI 4H-SiC samples with varying residual N concentration (~ 7x1014 – 5.2x1016 cm-3). Most notably, a linear relationship was found between Qo/I77 and [N] for [N] < 1x1016 cm-3 while a sub-linear behavior was observed for samples with higher N levels. This technique should be particularly valuable to map [N] where the levels are close to or below the present SIMS detection limit of ~ 5-7 x 1014 cm-3. Results obtained for a limited number of low n-type and SI 6H-SiC substrates are also presented.

Abstract: High temperature anneals were used to study the evolution of native defects in semiinsulating (SI), ultrahigh purity SiC using electron paramagnetic resonance (EPR), infrared and visible photoluminescence (PL) and COREMA (Contactless Resistivity Mapping) measurements. In EPR we observe a defect that we tentatively identify as VC-CSi-VC. The EPR intensities of this defect and the UD1 IRPL increase significantly with annealing in all samples.

Abstract: Deep electron and hole traps were studied in a series of high purity 6H-SiC single crystals grown by Halide Chemical Vapor Deposition (HCVD) method at various C/Si flow ratios and at temperatures between 2000 oC and 2100 oC. Characterization included Low Temperature Photoluminescence (LTPL), Deep Level Transient Spectroscopy (DLTS), Minority Carrier Transient Spectroscopy (MCTS), and Thermal Admittance Spectroscopy (TAS) measurements. Concentrations of all deep traps were shown to strongly decrease with increased C/Si flow ratio and with increased growth temperature. The results indicate that the majority of deep centers in 6H-SiC crystals grown by HCVD are due to native defects or complexes of native defects promoted by Si-rich growth conditions. The observed growth temperature dependence of residual donor concentration and traps density is explained by increasing the effective C/Si ratio at higher temperatures for the same nominal ratio of C and Si flows.