Authors: Ning Zhang, Yi Chen, Edward Sanchez, David R. Black, Michael Dudley
Abstract: The influence of substrate surface scratches on the quality of CVD grown 4H-SiC homo-epitaxial layers has been studied using a combination of post-growth Monochromatic Synchrotron X-ray Topography (MSXT) and KOH etching. MSXT observations suggest that the scratches on the substrate surface act as dislocation nucleation centers during the growth. When the scratch is along the off-cut direction, only TED-TED pairs are generated. As the inclination of the scratch to the off-cut direction increases, an increasing number of TED-BPD pairs are generated. A model is presented for a possible mechanism for the nucleation of dislocations at scratches.
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Authors: Yi Chen, R. Balaji, Michael Dudley, Madhu Murthy, Serguei I. Maximenko, Jaime A. Freitas
Abstract: Comparative studies of defect microstructure in 4H-SiC wafers have been carried out
using photoluminescence (PL) imaging and grazing-incidence Synchrotron White Beam X-ray
Topography. Images of low angle grain boundaries on the PL images correlate well with SWBXT
observations, and similar correlation can be established for some micropipe images although the
latter is complicated by the overall level of distortion and misorientation associated with the low
angle grain boundaries and the fact that many of the micropipes are located in or close to the
boundaries. This validation indicates that PL imaging may provide a rapid way of imaging such
defect structures in large-scale SiC wafers.
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Authors: Yi Chen, Xian Rong Huang, Ning Zhang, Michael Dudley, Joshua D. Caldwell, Kendrick X. Liu, Robert E. Stahlbush
Abstract: Electron-hole recombination activated Shockley partial dislocations bounding expanding
stacking faults and their interactions with threading dislocations have been studied in 4H-SiC
epitaxial layers using synchrotron x-ray topography. The bounding partials appear as white stripes
or narrow dark lines in back-reflection X-ray topographs recorded using the basal plane reflections.
Such contrast variations are attributable to the defocusing/focusing of the diffracted X-rays due to
the edge component of the partial dislocations, which creates a convex/concave distortion of the
basal planes. Simulation results based on the ray-tracing principle confirm our argument. The sign
of the partial dislocations can be subsequently determined.
357
Authors: Ping Wu, Murugesu Yoganathan, Ilya Zwieback, Yi Chen, Michael Dudley
Abstract: Etching of 4H-SiC wafers in molten KOH as a method for micropipe and dislocation
density analysis was investigated. The obtained results were correlated with those of the synchrotron
white beam x-ray topography. Heavily nitrogen-doped SiC shows a significantly different etching
behavior in comparison with the low-doped material. This complicates identification of different
types of threading defects. In particular, it is difficult to separate Threading Screw Dislocations
(TSD) from Threading Edge Dislocations (TED). Depending on the level of doping and thermal
history of the crystal, some of the etch pits emerging due to the 1c screw dislocations can be as large as
those due to the micropipes.
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Authors: Isaho Kamata, Masahiro Nagano, Hidekazu Tsuchida, Yi Chen, Michael Dudley
Abstract: Threading edge dislocations (TEDs) in a 4H-SiC epitaxial layer are investigated using
high-resolution synchrotron topography. Six types of TED image are confirmed to correspond to the
Burgers vector directions by a comparison of computer simulated images and observed topography
images in crystal boundaries. Using a mapping method, a wide spatial distribution of the six types
of TED is examined in a quarter section of a 2-inch wafer.
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Authors: Yi Chen, Ning Zhang, Xian Rong Huang, David R. Black, Michael Dudley
Abstract: The density and sense distribution of elementary threading screw dislocations in a
physical vapor transport grown 3-inch 4H silicon carbide wafer have been studied. The density of
TSDs ranges between 1.6×103/cm2 and 7.1×103/cm2 and the lowest density is observed at positions
approximately half radius off the wafer center. The dislocation sense of elementary threading screw
dislocations can be readily revealed by the asymmetric contrast of their images in grazing-incidence
x-ray topographs using pyramidal plane reflections. The circumferential and radial distributions of
the sense of elementary threading screw dislocations have been studied and no clear trends are
observed in either distribution.
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Authors: Yi Chen, Xian Rong Huang, Govindhan Dhanaraj, Michael Dudley, Edward Sanchez, Mike F. MacMillan
Abstract: Grazing-incidence synchrotron topography studies of micropipes (MPs) and closed-core
threading screw dislocations (TSDs) have been carried out and the results compared with ray-tracing
simulations. Simulations indicate that both MPs and TSDs appear as roughly elliptically shaped white
features which are canted to one side or the other of the g-vector depending on the dislocation sense
and which have asymmetric perimeters of dark contrast which are greatly enhanced on the side
towards which the feature is canted (again depending on the dislocation sense). For MPs,
observations are generally consistent with this although the cant of the features is more obviously
discerned than the asymmetry in the perimeter contrast. Sense assignment for MPs has been validated
using back-reflection reticulography. For TSDs, observation are again generally consistent with the
simulations although the smaller feature size and the variability in the line direction of the TSDs make
the asymmetry of perimeter contrast a more obvious and reliable way to determine the dislocation
sense than the sense of cant. TSD dislocation senses so obtained were validated using back-reflection
images of same-sign and opposite-sign pairs.
297
Authors: Michael Dudley, Yi Chen, Xian Rong Huang, Rong Hui Ma
Abstract: A review is presented of the current understanding of the dislocation configurations
observed in PVT-grown 4H- and 6H-SiC boules and CVD-grown 4H-SiC homoepitaxial layers. In
both PVT-grown boules and CVD-grown epilayers, dislocation configurations are classified
according to whether they are growth dislocations, i.e., formed during growth via the replication of
dislocations which thread the moving crystal growth front, or result from deformation processes
(under either mechanical or electrical stress) immediately following growth, during post growth
cooling, i.e., behind the crystal growth front or during device operation. Possible formation
mechanisms of growth defects in the PVT grown boules, such as axial screw dislocations and
threading edge dislocation walls are proposed. Similarly, possible origins of growth defect
configurations in CVD-grown epilayers, such as Frank faults bounded by Frank partials, BPDs and
TEDs, are also discussed. In a similar way, the origins of BPD configurations resulting from
relaxation of thermal stresses during post-growth cooling of the PVT boules are discussed. Finally,
the susceptibility of BPD configurations replicated into CVD grown epilayers from the substrate
towards Recombination Enhanced Dislocation Glide (REDG) is discussed.
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Authors: Mike F. MacMillan, Edward Sanchez, Michael Dudley, Yi Chen, Mark J. Loboda
Abstract: Thick (> 25 µm) 4H n+ epitaxial layer growth was performed on 4H n+ substrates utilizing chlorine containing etch chemistries in a hot wall CVD system. Optimization of the n+ epitaxial layer growth was achieved by varying C/Si ratio and N2 flow. Desired epitaxial layers have doping levels > 5x1018 cm-3, epitaxial surface roughness <10 nm on a 20x20 µm area and overall micropipe density reduction. To confirm the conversion of micropipes into closed core screw dislocations, microscopic examination of the epitaxial and wafer surfaces was carried out after KOH etching. Grazing incidence x-ray topography (XRT) as well as cross sectional XRT and microscopy were also performed. The cross sectional evaluation showed that the dissociation of the micropipes occurs very close to the epitaxy/wafer interface.
167
Authors: Yi Chen, Govindhan Dhanaraj, William M. Vetter, Rong Hui Ma, Michael Dudley
Abstract: The interactions between basal plane dislocations (BPDs) and threading screw and edge
dislocations (TSDs and TEDs) in hexagonal SiC have been studied using synchrotron white beam
x-ray topography (SWBXT). TSDs are shown to strongly interact with advancing basal plane
dislocations (BPDs) while TEDs do not. A BPD can cut through an individual TED without the
formation of jogs or kinks. The BPDs were observed to be pinned by TSDs creating trailing
dislocation dipoles. If these dipoles are in screw orientation segments can cross-slip and annihilate
also potentially leaving isolated trailing loops. The three-dimensional (3D) distribution of BPDs can
lead to aggregation of opposite sign edge segments leading to the creation of low angle grain
boundaries (LAGBs) characterized by pure basal plane tilt of magnitude determined by the net
difference in densities of the opposite sign dislocations. Similar aggregation can also occur against
pre-existing prismatic tilt boundaries made up of TED walls with the net difference in densities of
the opposite sign dislocations contributing some basal plane tilt character to the LAGB.
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