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CONFERENCE
12/9/2012 - 12/12/2012
ACAM7: The 7th Australasian Congress on Applied Mechanics
11/16/2012 - 11/18/2012
2nd International Conference on Manufacturing Engineering and Automation (ICMEA2012)
11/16/2012 - 11/18/2012
more...
Articles by author: Yu Li Sun
19 papers on 2 pages:
1
[2]
[next]
Characterization of Diamond Spherical Shell Thick Film by DC Plasma CVD
Published in:
Advances in Machining & Manufacturing Technology IX
(p216)
Computer Simulation on the Motion Tracks of Ice Fixed Abrasives Polishing
Published in:
Functional Manufacturing Technologies and Ceeusro I
(p376)
Effect of Ice Counterparts on the Friction Behavior of Single Crystal Silicon Wafer
Published in:
Surface Finishing Technology and Surface Engineering
(p167)
Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw
Published in:
Machining and Advanced Manufacturing Technology X
(p25)
Experimental Study on Cryogenic Polishing Single Silicon Wafer with Nano-Sized Cerium Dioxide Powders
Published in:
Precision Surface Finishing and Deburring Technology
(p177)
FEM Simulation on the Temperature Distribution of Ice Fixed Abrasives Polishing
Published in:
Machining and Advanced Manufacturing Technology X
(p1)
Friction and Wear of Polished Single Crystal Silicon at Different Area
Published in:
Advanced Design and Manufacturing Technology I
(p117)
Fundamental Study on Diamond Spherical Shell Film for Polishing of Concave Spherical Surface
Published in:
Advances in Machining & Manufacturing Technology IX
(p380)
Investigation on Strain Films in the Thin Film Resistance Strain Gauge
Published in:
Advances in Machining & Manufacturing Technology IX
(p690)
Investigation on the Machining of Thick Diamond Films by EDM Together with Mechanical Polishing
Published in:
Precision Surface Finishing and Deburring Technology
(p377)
Mechanism of Brittle-Ductile Transition of Single Silicon Wafer at Different Temperatures
Published in:
Advances in Grinding and Abrasive Technology XIV
(p1)
Mechanism of Brittle-Ductile Transition of Single Silicon Wafer Using Nanoindentation Techniques
Published in:
Advances in Machining & Manufacturing Technology IX
(p52)
Progress of Research in Slicing Technology of Large-Scale Silicon Wafers
Published in:
Advances in Machining & Manufacturing Technology IX
(p1)
Simulation on the Melting Rate of the Iced Fixed-Abrasive Polishing Plate
Published in:
Functional Manufacturing Technologies and Ceeusro I
(p21)
Status and Trends of Fixed Abrasive Polishing on Semiconductor
Published in:
Anti-Fatigue Design and Manufacturing Technologies I
(p390)
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