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Articles by author: Zhu Ji Jin

• A Method for Grinding Mode Identification in Grinding of Silicon Wafers
  Published in: Precision Surface Finishing and Deburring Technology (p255)
• A Study of the Molecular Dynamics Simulation in Nanometric Grinding
  Published in: Advances in Abrasive Technology VI (p33)
• A Suspending Abrasives and Porous Pad Model for the Analysis of Lubrication in Chemical Mechanical Polishing
  Published in: Advances in Machining & Manufacturing Technology VIII (p775)
• An Experimental Study of the Polishing Process for MgO Single Crystal Substrate
  Published in: Advances in Abrasive Technology IX (p225)
• Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
  Published in: Advances in Abrasive Technology XI (p36)
• Corrosion Inhibiting Effect on Copper Chemical Mechanical Planarization (CMP) in Fe(NO₃)₃ Based Slurries
  Published in: Advances in Abrasive Technology VIII (p395)
• Effects of Suspending Abrasives on the Lubrication Properties of Slurry in Chemical Mechanical Polishing of Silicon Wafer
  Published in: Advances in Grinding and Abrasive Technology XIII (p359)
• Electroforming of Copper/ZrB₂ Composites Coatings and Its Performance as Electro-Discharge Machining Electrodes
  Published in: Advances in Abrasive Technology VIII (p537)
• Experimental Investigation of Brittle to Ductile Transition of Single Crystal Silicon by Single Grain Grinding
  Published in: Advances in Abrasive Technology IX (p433)
• Friction Characteristic of Wafer Surface in Chemical Mechanical Polishing
  Published in: Advances in Abrasive Technology VIII (p389)
• Friction-Based In Situ Endpoint Detection of Copper CMP Process
  Published in: Surface Finishing Technology and Surface Engineering (p125)
• Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer
  Published in: Advances in Materials Manufacturing Science and Technology (p362)
• Magnetic Abrasive Finishing of Non-Ferromagnetic Tube
  Published in: Advances in Grinding and Abrasive Processes (p530)
• Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer
  Published in: Advances in Materials Manufacturing Science and Technology (p26)
• Molecular Dynamics Analyze on Effects of Abrasive Size and Cut Depth on the Monocrystal Silicon Grinding
  Published in: Advances in Grinding and Abrasive Technology XIII (p286)