Articles by author: Zhu Ji Jin
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Novel Measurement Technique on 3D Surface Topography of Polishing Pad
Published in: Surface Finishing Technology and Surface Engineering (p265) -
Polishing of Free-Standing CVD Diamond Films by the Combination of EDM and CMP
Published in: Surface Finishing Technology and Surface Engineering (p111) -
Raman Microspectroscopy Study on the Ground Surface of Monocrystalline Silicon Wafers
Published in: Advances in Grinding and Abrasive Technology XIII (p241) -
Research on Effects of Slurry Additives in Cu CMP for ULSI Manufacturing
Published in: Advances in Grinding and Abrasive Technology XIII (p350) -
Study on Adhesion Removal Model in CMP SiO2 ILD
Published in: Advances in Abrasive Technology XI (p475) -
Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer
Published in: Advances in Grinding and Abrasive Technology XV (p529) -
Study on the Surface and Subsurface Integrity of Ground Monocrystalline Silicon Wafers
Published in: Advances in Abrasive Technology VIII (p425) -
Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film
Published in: Advances in Abrasive Technology XI (p217) -
The Characteristics of Surface Residual Stresses by Plane Grinding Invar and the Effects of Them on Structural Stability
Published in: Surface Finishing Technology and Surface Engineering (p293) -
The High-Efficient Low-Cost Wheel-Grinding Technology for CVD Diamond Films
Published in: Precision Surface Finishing and Deburring Technology (p295) -
The Thermal Characteristics of Invar 36 Alloy during Plane Grinding
Published in: Manufacturing Science and Engineering I (p918) -
Theoretical Analysis and Experimental Verification of Triangular Fracture Defects of MgO Single Crystal Substrate in Lapping or Polishing Process
Published in: Optics Design and Precision Manufacturing Technologies (p739) -
Towards a Deep Understanding of Molecular Dynamics Simulation in Nanometric Machining
Published in: Advances in Grinding and Abrasive Processes (p216)