Papers by Keyword: Germanium

Abstract: Like on 6H-SiC substrates, 3C-SiC islands precipitation was found to be the initial stage of the VLS growth of 3C-SiC layers on 4H-SiC surfaces. This precipitation happens between 1100 and 1200°C with a heating rate of 2.8°C.s-1, without addition of propane. The islands size increases in a similar manner whether the final temperature increases (for a given heating rate) or the heating rate decreases (for a given final temperature). This enlargement can give rise to a complete cubic layer for the highest temperatures or the slowest heating rates. It is suggested that the carbon atoms involved in the enlargement process (after the nucleation) come from the graphite crucible.

Abstract: Silicon carbide as a material for electronic devices still has substantial problems concerning its structural quality and defects. It has been shown that dopants can have a big influence on structural properties like polytype stability and dislocation statistics [1]. We will discuss the effect of an isoelectronic dopant in silicon carbide. Germanium, being a member of the 4th group in the periodic table of elements like silicon and carbon, will not influence the electrical properties of the material such as e.g. aluminum. In our experiments we reached concentrations of up to 1*1020 cm-3. We have observed an impact on the polytype stability during sublimation growth with in-situ germanium incorporation. We investigated an influence on the dislocation statistics during growth and, hence, varying germanium concentration. We found only a slight decrease in mobility during Hall measurements but no severe changes in electrical properties of the material.

Abstract: The formation of self-assembled monolayers (SAMs) by specific organic molecules with appropriate anchor groups on semiconductor surfaces may be used to probe the chemical state and quality of the surface or to achieve surface passivation. Molecules with thiol anchor groups are able to bond to hydrogen-terminated germanium surfaces (Ge-S bond). We have prepared SAMs of alkylthiols with different head groups on germanium. Since the surface preparation of germanium is neither well understood nor developed, the controlled preparation of an oxide-free completely H-terminated surface which is a prerequisite for SAM formation of alkylthiols turned out to be a major challenge. Several approaches have been studied. The characterization of the germanium surface prior to and after SAMs formation has been performed by AFM, XPS, Synchrotron-TXRF and -NEXAFS.

Abstract: Pseudomorphic 4H-(Si1-xC1-y)Gex+y solid solutions were formed by ion implantation at 600°C and rapid thermal annealing at implanted Ge concentrations below 10%. At higher implantation doses followed by annealing 3C-SiC inclusion and SiGe precipitates are formed. Transmission electron microscopy investigations accompanied with “atomic location by channeling enhanced microanalysis” of the annealed samples revealed an increasing incorporation of Ge on Si lattice sites.

Abstract: In this paper we present a methodology to affect the stability of polytypes formation during heteroepitaxial growth of SiC on Si. This methodology is based on the investigation of growth related parameters. These parameters involve substrate temperature, effect of impurities on surface diffusion, strain, and super-saturation conditions as solved by using SSMBE growth (Solid Source molecular beam epitaxy).

Abstract: Twin-free 3C-SiC layers were recently obtained by Vapour-Liquid-Solid mechanism on a a-SiC(0001) substrate using Si-Ge melt. The formation of cubic layers is rather unexpected since growth from the melt is known to promote lateral growth and should thus give homoepitaxial layers. The study of the early stage of such growth, after a simple contact between the melt and the substrate (without adding propane), reveals the precipitation of 3C-SiC elongated islands upon the substrate surface. The chemical interactions inside the Ge-Si-C ternary phase diagram suggest an initial dissolution of the SiC seed in contact with a Ge-rich melt (below 1200°C). When the Si content of the melt subsequently increases upon heating, the dissolved carbon atoms precipitate on the seed surface under the form of 3C-SiC islands. When propane is added, these islands enlarge and coalesce to form a complete 3C layer.

Abstract: The growth kinetics of 3C-SiC heteroepitaxial layers on α-SiC substrates by Vapour-Liquid-Solid (VLS) mechanism in Ge-Si melts was investigated. Various parameters were studied such as temperature, melt composition, propane flux and substrate nature (polytype, polarity and misorientation). It was found that the growth rate increases with increasing temperature, propane flux, Si content of the melt and misorientation of the substrate. The calculated activation energy (from 4.7 to 6.6 kcal/mole depending on the substrate type) is very small suggesting that the limiting process is the diffusion of the dissolved carbon inside the melt. The carbon solubility inside the melt mainly affects the carbon dissolution kinetics from the gas phase. The results also suggest that surface effects are important through the layer polarity and crystalline quality.

Abstract: We report on the heteroepitaxial growth of 3C-SiC layers by Vapor-Liquid-Solid (VLS) mechanism on Si face 6H-SiC substrates, on-axis and 3.5° off. The Si-Ge melts, which Si content was varied from 10 to 50 at%, were fed by 3 sccm of propane. The growth temperature was varied from 1200 to 1600°C. It was found that 3C-SiC layers (either twinned or twinned free) form at low temperature while homoepitaxy is achieved at high temperature. The proposed growth mechanism involves the initial formation of 3C islands during the heating ramp (below 1200°C) and the dissolution of these islands when temperature increases. Geometrical aspects, such as the step density at the surface and the vertical component of the growth, are also considered to explain the difference observed between the on and off axis substrates.

Abstract: There is a clear and increasing interest in short time thermal processing far below one second, i.e. the lower limit of RTP (Rapid Thermal Processing) called spike annealing. It is the world of processing in the millisecond or nanosecond range. This was driven by the need of suppressing the so-called Transient Enhanced Diffusion in advanced boron-implanted shallow pnjunctions in the front-end silicon chip technology. Meanwhile the interest in flash lamp annealing (FLA) in the millisecond range spread out into other fields related to silicon technology and beyond. This paper reports shortly about the restart in flash lamp annealing of the Rossendorf group in collaboration with the Mattson group and further on recent experiments regarding shallow junction engineering in germanium, annealing of ITO (indium tin oxide) layers on glass and plastic foil to form an conductive layer as well as investigations which we did during the last years in the field of wide band gap semiconductor materials (SiC, ZnO). Moreover recent achievements in the field of silicon-based light emission basing on Metal-Oxide-Semiconductor Light Emitting Devices will be reported. Finally it will be demonstrated that the basic principle of short time thermal processing, i.e. surface heating on a colder bulk, features also advantages regarding the casting of lead sheets to produce organ pipes in the spirit of the 17th century.

Abstract: Vacancies and interstitials in semiconductors play a fundamental role in both high temperature diffusion and low temperature radiation and implantation damage. In Ge, a seri- ous contender material for high-speed electronics applications, vacancies have historically been believed to dominate most diffusion related phenomena such as self-diffusivity or impurity mi- gration. This is to be contrasted with silicon, where self-interstitials also play decisive roles, despite the similarities in the chemical nature of both materials. We report on density func- tional calculations of the formation and properties of vacancy-donor complexes in germanium. We predict that most vacancy-donor aggregates are deep acceptors, and together with their high solubilities, we conclude that they strongly contribute for inhibiting donor activation levels in germanium.