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Articles by keyword: «Low-K»

• Characteristic of Nanoporous SiO₂ Thin Film Prepared by Sol-Gel Method with Catalyst HF
  Published in: PRICM-5 (p1733)
• Electrical/Mechanical Properties of Porous Low-k Thin Films by Using Various Supramolecule Based Porogen
  Published in: Advances in Nanomaterials and Processing (p185)
• Formation and Characteristics of the Low Dielectric Carbon Doped Silicon Oxide Thin Film Deposited by MTMS/O₂ – ICPCVD
  Published in: PIM & ASIP 2004 (p103)
• Investigation on Thin Films Deposited by PECVD from a DiPhenylMethylSilane (DPMS) Vapors or Mixed with Oxygen for Low-K Material Application
  Published in: Laser and Plasma Applications in Materials Science (p35)
• New Dry Tool after Cleaning of Low-k Dielectrics
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p287)
• Photoresist Characterization and Wet Strip after Low-k Dry Etch
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p325)
• Positron and Positronium Annihilation in Low-Dielectric-Constant Films Studied by a Pulsed Positron Beam
  Published in: Positron Annihilation - ICPA-13 (p224)
• Positronium Annihilation Lifetime Spectroscopy of Porous Low-k Films with Periodic Pore Structures
  Published in: Positron Annihilation - ICPA-13 (p334)
• Preparation and Characterization of Porous Hydrogen Silsesquioxane by Sol-Gel Process
  Published in: Science and Technology Hybrid Materials (p115)
• Structural and Mechanical Properties of Low Dielectric Constant SiOC(-H) Films Using MTES/O₂ Deposited by PECVD
  Published in: Advances in Nanomaterials and Processing (p239)
• Supercritical Carbon Dioxide Cleaning of Low-k Material
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p297)
• The Hydrogen Heat Treatment Effect on Electrical and Structural Properties of a-SiOC:H as Low-k Thin Films
  Published in: Advances in Nanomaterials and Processing (p323)