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Paper Titles
Improvement of Bake-Hardening Response of Al-Mg-Cu Alloys by Means of Nanocluster Assist Processing (NCAP) Technique
p.215
HRTEM Study of Precipitates in Al-Mg-Si and Al-Mg-Ge Alloys
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The Effect of Composition and Temperature on the Ageing Response of some Dilute 6xxx Series Alloys
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Precipitation Behaviour of Mg and Si at RT in Pre-Aged Al-Mg-Si Alloys
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The Effect of Intermediate Storage Temperature and Time on the Age Hardening Response of Al-Mg-Si Alloys
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3DAP Characterization and Thermal Stability of Nano-Scale Clusters in Al-Mg-Si Alloys
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Precipitation Hardening in Al-Cu-Mg Alloys: Analysis of Precipitates, Modelling of Kinetics, Strength Predictions
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Crystal Analysis of Nonequilibrium δnon-Phase in Al-Li-Mg Alloys
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Nature of Formation of the Areas Having an Ultrafine Grain Structure in Al-Li-Mg System Alloys
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The Effect of Intermediate Storage Temperature and Time on the Age Hardening Response of Al-Mg-Si Alloys

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Abstract:

Specimens of three Al-Mg-Si alloys, 6060, 6005 and 6082, were solution heat treated, stored at different temperatures for different time, and artificially aged. Properties were measured before and after artificial ageing. The natural ageing response of the alloys is dependent on the storage temperature. Decreasing storage temperature leads to a delayed onset of natural ageing, but also to a higher strength after prolonged ageing, particularly for lean alloys such as 6060. The temperature and time of intermediate storage between solution heat treatment and artificial ageing has a significant effect on the strength of the artificially aged material. For the 6005 and 6082 alloys the processes that take place during natural ageing lead to a reduced strength after artificial ageing.

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Periodical:

Materials Science Forum (Volumes 519-521)

Pages:

239-244

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.519-521.239

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Online since:

July 2006

Authors:

Jostein Røyset, Tore Stene, Jan Anders Sæter, Oddvin Reiso

Keywords:

Age Hardening, Al-Mg-Si, Cluster, Intermediate Storage, Vacancy

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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