System Analysis and Design of Gripping Device for Wafer Transfer Robot

Abstract:

This paper analyzes the decision method for selecting components of gripping devices for wafer transfer robots from the system point of view and thus provides the basis for type selection and design. Analysis is completed through four steps: First, introduce the role of wafer transfer robot and gripping device in IC manufacture system and analyze the fundamental functions that are essential for wafer gripping; Second, analyze wafer gripping device systematically and divide it into six parts which are called basic elements and provide the implementation methods respectively; Third, analyze and summarize specific requirements to wafer gripping device in wafer transfer process; Finally, analyze and compare the relativity between each basic element and the specific requirement, then give the analysis result in the use of a data table. Through the above analysis of this paper, designers of wafer transfer robot can do analysis and comparison to select suitable components for wafer gripping device, thereby shorten the design circle of robots and improve efficiency.

• Periodical: Advanced Engineering Forum (Volumes 2-3)
• Pages: 314-319
• DOI: https://doi.org/10.4028/www.scientific.net/AEF.2-3.314
• Online since: December 2011
• Authors: Peng Zhang, Xian Wen Zhuang, Li Na Hao, Hong Tao Liu
• Keywords: Edge Gripping Devices, End Effector, IC Manufacture, Wafer Transfer Robot

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