A Model of CMP about Magnetic Fluid and its Numerical Simulations

Yong Zhou Li; Xiao Ping Fan; Qiu Yun Zheng

doi:10.4028/www.scientific.net/AMM.101-102.333

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 101-102A Model of CMP about Magnetic Fluid and its...

A Model of CMP about Magnetic Fluid and its Numerical Simulations

Abstract:

Chemical mechanical polishing (CMP) is one of the most effective technologies in modern ultra-precision processing. In this paper, we consider the slurry is ferromagnetic fluid and the influence of the centrifugal force, and then obtain the equations about this slurry in CMP. The slurry pressure distribution, resultant forces and moments acting on the wafer are calculated in typical conditions, and the affects of film thickness, roll and pitch angles are also calculated.

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Periodical:

Applied Mechanics and Materials (Volumes 101-102)

Pages:

333-338

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.101-102.333

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Online since:

September 2011

Authors:

Yong Zhou Li, Xiao Ping Fan, Qiu Yun Zheng

Keywords:

Chemical Mechanical Polishing (CMP), Film Thickness, Magnetic Fluid, Pressure Distribution

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