A Model of CMP about Magnetic Fluid and its Numerical Simulations

Abstract:

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Chemical mechanical polishing (CMP) is one of the most effective technologies in modern ultra-precision processing. In this paper, we consider the slurry is ferromagnetic fluid and the influence of the centrifugal force, and then obtain the equations about this slurry in CMP. The slurry pressure distribution, resultant forces and moments acting on the wafer are calculated in typical conditions, and the affects of film thickness, roll and pitch angles are also calculated.

Info:

Periodical:

Edited by:

Di Zheng, Yiqiang Wang, Yi-Min Deng, Aibing Yu and Weihua Li

Pages:

333-338

DOI:

10.4028/www.scientific.net/AMM.101-102.333

Citation:

Y. Z. Li et al., "A Model of CMP about Magnetic Fluid and its Numerical Simulations", Applied Mechanics and Materials, Vols. 101-102, pp. 333-338, 2012

Online since:

September 2011

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Price:

$35.00

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